2004
DOI: 10.1016/s0169-4332(03)00753-0
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Surface strengthening pure copper by Ni-B coating

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Cited by 63 publications
(21 citation statements)
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“…Since Taguchi method obtains the optimal level combination by choosing those levels for which S/N ratio is the highest, the optimal combination of parameters is found to be A3B3C2D2. The increased hardness of Ni-B coatings heat treated at D2 (350 • C) is quite consistent with the findings of [24]. Also 350…”
Section: Analysis Of Signal-to-noise Ratio Signal-to-noise (S/n)supporting
confidence: 87%
“…Since Taguchi method obtains the optimal level combination by choosing those levels for which S/N ratio is the highest, the optimal combination of parameters is found to be A3B3C2D2. The increased hardness of Ni-B coatings heat treated at D2 (350 • C) is quite consistent with the findings of [24]. Also 350…”
Section: Analysis Of Signal-to-noise Ratio Signal-to-noise (S/n)supporting
confidence: 87%
“…Ziyuan et. al., [20] contradictorily reported that the corrosion performance of as coated Ni-B is greater than that of as coated Ni-P coating. Due to the contradiction in corrosion performance of Ni-B coating, this work has concentrated on comparing the corrosion performance of Ni-P and Ni-B in as-coated as well as varying annealing temperatures.…”
Section: Introductionmentioning
confidence: 98%
“…However, with a lower strength and poor wear resistance, this material cannot be used in certain applications where excellent strength or good wear resistance are required [1]. In order to improve the wear resistance of pure Cu, several methods have been developed that raise the strength and wear resistance, including internal oxidation [2], chemical vapor deposition (CVD) [3,4], electroplating, electroless plating [5], and other methods [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…In order to improve the wear resistance of pure Cu, several methods have been developed that raise the strength and wear resistance, including internal oxidation [2], chemical vapor deposition (CVD) [3,4], electroplating, electroless plating [5], and other methods [6][7][8]. Among these methods, electroless plating has the advantages of simplicity and greater relative feasibility in terms of changing the characteristics of a pure Cu surface [1]. Since its development by Brenner and Riddell in 1946, electroless plating has undergone a number of modifications to satisfy the challenging needs of a variety of industrial applications [9].…”
Section: Introductionmentioning
confidence: 99%
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