Surface Warpage Measurement of Wood at Elevated Temperature by Shadow Moiré Method

Abstract

A full-field method to measure the surface warpage of wood plate at elevated temperature by phase-shifted shadow moiré method is presented. Test of the method on a cypress wood plate is demonstrated. A comparison of the test results at room temperature to the ones obtained by contact type sensor was made. A good agreement between them is shown. Further measurement of the plate warpage at elevated temperature reveals the warping behavior of wood plate.