2011
DOI: 10.1016/j.spmi.2010.11.001
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Surfactant effects of indium on cracking in AlN/GaN distributed Bragg reflectors grown via metal organic vapor phase epitaxy

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Cited by 9 publications
(5 citation statements)
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“…The fabrication starts with the growth of layers that make up the LED active regions using MOVPE techniques [38], [39]. The LED structure is grown on a sapphire substrate (430 μm thick) and is shown in the Fig.…”
Section: Device Fabricationmentioning
confidence: 99%
See 1 more Smart Citation
“…The fabrication starts with the growth of layers that make up the LED active regions using MOVPE techniques [38], [39]. The LED structure is grown on a sapphire substrate (430 μm thick) and is shown in the Fig.…”
Section: Device Fabricationmentioning
confidence: 99%
“…1. [39], [38]. InGaN/GaN -based quantum wells with a periodicity of 11.90 nm (QW ∼ 4 nm, Barrier ∼ 8 nm) were grown with 16% indium concentration (In 0.16 Ga 0.94 N) on n-type (Silicon doped) GaN and followed by p-type (Magnesium doped) GaN.…”
Section: Device Fabricationmentioning
confidence: 99%
“…7 Lack of low-cost and highquality GaN substrates has necessitated epitaxy on mismatched substrates, leading to large defect densities. 9 The large lattice mismatch between GaN and AlN has prevented the realization of high quality Bragg mirrors 10 and low threshold vertical cavity surface emitting lasers (VCSELs) 6 and electrically pumped polariton lasers, 11,12 where such mirrors are needed. Ga(In)N nanowires can be epitaxially grown without a catalyst on (001) or (111) silicon substrate in the wurtzite crystalline form with the c-axis parallel to the growth direction.…”
mentioning
confidence: 99%
“…Electron beam evaporation is used for evaporating the ohmic p-metal contact containing nickel and gold metals of thicknesses 30 and 150 nm respectively. The thicknesses of the metals were previously optimized to behave like an ohmic metal contact with p-type GaN material [68]. The sample with evaporated metal is left in an acetone bath to facilitate the lift-off procedure and expose the contact on the sample as shown in the Figure 5.5.…”
Section: Figure 54 Photolithography Process For Metal Contact Pattermentioning
confidence: 99%
“…With the precise control of the epitaxial growth and fabrication methods, the device-level characteristics (shown in the Figure 1.4 b.) are optimized for repeatable and stable devices[26],[27].…”
mentioning
confidence: 99%