2019
DOI: 10.1016/j.indcrop.2019.04.043
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Sustainable hot-melt adhesives based on soybean protein isolate and polycaprolactone

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Cited by 41 publications
(9 citation statements)
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“…In Figure 4, referring to the derivative of the thermal degradation curve, it is possible to observe that the temperature at which PCL degradation rate is maximum ( T max ) is approximately 448°C. The obtained values of T i and T f in the present study varied by approximately 20°C, in relation to the studies found in the literature, which may have occurred due to the use of different heating rates and also the shape of the material, since in this work it was analyzed PCL pellets 49–51 …”
Section: Resultssupporting
confidence: 84%
“…In Figure 4, referring to the derivative of the thermal degradation curve, it is possible to observe that the temperature at which PCL degradation rate is maximum ( T max ) is approximately 448°C. The obtained values of T i and T f in the present study varied by approximately 20°C, in relation to the studies found in the literature, which may have occurred due to the use of different heating rates and also the shape of the material, since in this work it was analyzed PCL pellets 49–51 …”
Section: Resultssupporting
confidence: 84%
“…Aer sufficient washing, it was fully dried at 103 C for 3 hours and its weight (M g) was recorded. The residual rate of adhesive was calculated by formula (2).…”
Section: Testing Of Adhesive Performancementioning
confidence: 99%
“…Soy-based adhesive has attracted more and more attention due to its advantages of easy degradation, renewable, and rich in yield. 1,2 However, soy-based adhesives have extremely low wet bonding performance due to the fact that the bonding force is only provided by intermolecular hydrogen bonds and the physical entanglement from the peptide chains, limiting the application of soy-based adhesives. In various soybased adhesives, the soy protein adhesive has the best performance but still inferior to petroleum-based resins.…”
Section: Introductionmentioning
confidence: 99%
“…In the stage of 60 to 150 • C (stage I), the thermal weightlessness rate (M SI ) was relatively low (≤5%), which was mainly caused by releasing of moisture in the adhesive, while there was no protein degradation [35]. In the stage II, the temperature was between 150 and 260 • C, the degradation behavior was mainly attributed to the unreacted micromolecular decomposition and some unstable chemical bond cleavage, including intra-/intermolecular hydrogen bonding, electrostatic bonds, and cleavage of the covalent bonding between the peptide bonds [36,37]. The degradation of protein skeleton occurred in the stage III (260-600 • C).…”
Section: Design Synthesis and Characterization Of Soybean Meal And mentioning
confidence: 99%