2018
DOI: 10.1007/s11664-018-6231-8
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Synthesis and Characterization of Cross-Linked Nanocomposite as a Gate Dielectric for p-Type Silicon Field-Effect Transistor

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Cited by 19 publications
(5 citation statements)
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“…As shown in Figure 9 b, Ti2p3/2 and Ti2p1/2 are the characteristic peaks of TiO 2 at the binding energy of 458.8 eV and 464.5 eV [ 64 , 65 ]. In the TMP (1:1)–TiO 2 complex, the characteristic peaks of TiO 2 were all shifted (redshifted) towards low binding energies by 0.15 eV and 0.17 eV, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…As shown in Figure 9 b, Ti2p3/2 and Ti2p1/2 are the characteristic peaks of TiO 2 at the binding energy of 458.8 eV and 464.5 eV [ 64 , 65 ]. In the TMP (1:1)–TiO 2 complex, the characteristic peaks of TiO 2 were all shifted (redshifted) towards low binding energies by 0.15 eV and 0.17 eV, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…Another significant improvement due to iron and nitrogen codoping is charge transfer. The transport properties of Fe–N-GDY were investigated in detail by fabricating field-effect transistors on a SiO 2 /Si substrate. Platinum electrodes were vapor-deposited on a single silicon wafer, and Fe–N-GDY material was sprayed on the silicon electrode sheet by inkjet printing to construct a field-effect transistor (FET), which is shown in Figure a. By utilizing a flexible substrate such as polydimethylsiloxane (PDMS), we can also assemble a printing FET device with the help of liquid-metal electrodes (eutectic gallium–indium, EGaIn) and an ionic liquid gate, as sketched in Figure b.…”
mentioning
confidence: 99%
“…However, the high fabrication cost of these vacuum deposition processes limits their large-scale application. As a newly developed AOS fabrication method, solution processing techniques offer the possibility of depositing thin films in a simple printing or coating manner, enabling the fabrication of low-cost and high-performance electrical devices [3][4][5], and the chemical composition of AOS films is easy to control compared to other physical deposition methods [6][7][8].…”
Section: Introductionmentioning
confidence: 99%