Synthesis and characterization of new soluble and thermally stable poly(ester-imide)s derived from N-[3,5-bis(N-trimellitoyl)phenyl]phthalimide and various bisphenols

Behniafar, HHossein; Akhlaghinia, Batool; Habibian, Sedigheh

doi:10.1016/j.eurpolymj.2004.12.001

Cited by 24 publications

(22 citation statements)

References 31 publications

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“…The non-substituted TAHQ/4,4 0 -ODA system showed a high T g at 340 C with a broad transition around 210 C in the DMTA curve (this lower temperature transition will be discussed later). The results revealed that the effect of the methoxy and methyl substituents caused a certain degree of T g increase (20)(21)(22)(23)(24)(25)(26)(27)(28)(29)(30) C) as shown in Table III. This can be interpreted in terms of suppressed internal rotation of the central hydroquinone moiety by some steric hindrance due to the present small substituents.…”

Section: Molecular Designmentioning

confidence: 91%

“…The extent of water absorption (W A ) was determined from the relation: ðW À W 0 Þ=W 0 Â 100 (%), where W 0 is the weight of PEsI films after immediately vacuum-drying at 50 C for 24 h, W denotes the weight of PEsI films which were immersed in water at 25 C for 24 h and wiped completely out with a tissue paper. The imide contents were calculated from the relation: FW (imide)/FW (unit) Â 100 (wt %) where FW (imide) and FW (unit) denote the formula weights of the imide group (O=C-N-C=O) and the repeating units.…”

Section: Measurementsmentioning

confidence: 99%

“…We previously proposed a hybrid material between PIs and polyesters, namely, poly(ester imide)s (PEsIs) as a new material for FCCL and our results revealed that some PEsIs derived from TAHQ with APAB and a minor fraction of a flexible diamine as a comonomers achieved a very low extent of water absorption, a low CTE value approximate to copper foil, and excellent flexibility (film toughness) at the same time. 19 Poly(ester imide)s have been so far studied only in the limited view points of film basic properties such as thermal stability and solubility, and mechanical properties, [20][21][22][23][24][25][26] mechanical properties of fibers, 27 liquid crystallinity [28][29][30] without any attentions toward FCCL applications. Many of the previously reported poly(ester imide)s were synthesized via the direct polymerization of polyester from imide-containing diols with dicarboxylic acids without the pathway of thermal imidization which plays a great role for spontaneous in-plane orientation.…”

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confidence: 99%

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Poly(ester imide)s Possessing Low CTE and Low Water Absorption (II). Effect of Substituents

Hasegawa

Tsujimura

Koseki

et al. 2007

Polym J

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The film properties of a variety of poly(ester imide)s (PEsIs) were evaluated for development of a novel high temperature base film in flexible printed circuit (FPC) boards. In this work, three types of PEsI systems were systematically prepared from the following combinations of monomers: (1) ester-containing tetracarboxylic dianhydrides: hydroquinone bis(trimellitate anhydride) (TAHQ), methyl-substituted TAHQ (M-TAHQ), and methoxy-substituted TAHQ (MeO-TAHQ) with common diamines such as p-phenylenediamine (PDA), (2) common tetracarboxylic dianhydrides such as pyromellitic dianhydride (PMDA) with ester-containing diamines: 4-aminophenyl-4 0 -aminophenylbenzoate (APAB) and methyl-substituted APAB (ATAB), and (3) the TAHQ series with the APAB series. The effects of the substituents on the PEsI film properties and polymerizability were also discussed in this work. The ester-containing monomers used in this work (TAHQ series and the APAB series) were all highly reactive and led to PEsAAs possessing high inherent viscosities ranging 1.09-9.33 dL/g. The incorporation of methyl and methoxy substituents into rigid TAHQ-based PEsI systems caused no significant decrease in T g but allowed molecular motions above the T g s. In some cases, these substituents, in particular, the methoxy group contributed to a significant decrease in water absorption without sacrificing other target properties. For practical FPC application, a flexible diamine was copolymerized into the highly esterified rigid PEsI systems derived from the TAHQ series with the APAB series. One of the PEsI copolymers obtained achieved excellent combined properties: a low CTE (17.8 ppm/K) completely consistent with that of copper foil as a conductive layer, considerably low water absorption (0.47 wt %), a high T g exceeding 360 C, and improved toughness (elongation at break > 40%). Polyimides (PIs) have been widely utilized in a variety of micro-and optoelectronic applications such as flexible printed circuit boards (FPC), chip on film (COF) assembling system, tape automated bonding tapes (TAB), buffer-coating films and interlayer dielectrics for LSI chips, high temperature adhesives, light wave guides for their combined excellent properties, i.e., high glass transition temperatures (T g ), high resistance to chemicals and radiation, relatively low dielectric constants, and good mechanical properties.1-10 The advantages of PI materials are considerably high purity (extremely low contents of metal contaminations and residual monomers and solvents) in the resins, simple fabrication processes, and the ease of structural modifications through copolymerization using various commercially available monomers.FPC, TAB, and COF are fabricated from PI film/Cu foil laminates (flexible copper clad laminates, FCCL or CCL). Adhesive-free FCCL has an advantage in the view point of dimensional stability against heat cycles compared to that using thermally less stable conventional adhesives. This type of FCCL is usually produced by the casting method (thermal imidization after s...

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Section: Molecular Designmentioning

confidence: 91%

Section: Measurementsmentioning

confidence: 99%

mentioning

confidence: 99%

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Poly(ester imide)s Possessing Low CTE and Low Water Absorption (II). Effect of Substituents

Hasegawa

Tsujimura

Koseki

et al. 2007

Polym J

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“…Aromatic polyester-imide is produced by soluble condensation polymerization in high temperature (Behniafar et al, 2005). Pyridine is used as absorbent of produced hydrogen chloride.…”

Section: Aromatic Polyester-imidementioning

confidence: 99%

Synthesis of Thermally Stable Polyesters

Mighani¹

2012

Polyester

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“…The reported experimental data have been taken from Refs. [15][16][17][18][19][20][21][22][23][24][25]. The Thermal stability evaluation of the resulting polymers was carried out by TGA/DTG in nitrogen at a heating rate of 10 °C/min.…”

Section: Methodsmentioning

confidence: 99%

Prediction of Thermal Decomposition Temperature of Polymers Using QSPR Methods

2008

Bulletin of the Korean Chemical Society

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The relationship between thermal decomposition temperature and structure of a new data set of eighty monomers of different polymers were studied by multiple linear regression (MLR). The stepwise method was used in order to variable selection. The best descriptors were selected from over 1400 descriptors including; topological, geometrical, electronic and hybrid descriptors. The effect of number of descriptors on the correlation coefficient (R) and F-ratio were considered. Two models were suggested, one model having four descriptors (R 2 = 0.894, Q

show abstract

Synthesis and characterization of new soluble and thermally stable poly(ester-imide)s derived from N-[3,5-bis(N-trimellitoyl)phenyl]phthalimide and various bisphenols

Cited by 24 publications

References 31 publications

Poly(ester imide)s Possessing Low CTE and Low Water Absorption (II). Effect of Substituents

Poly(ester imide)s Possessing Low CTE and Low Water Absorption (II). Effect of Substituents

Synthesis of Thermally Stable Polyesters

Prediction of Thermal Decomposition Temperature of Polymers Using QSPR Methods

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