Synthesis and characterization of novel polyaryloxydiphenylsilane derived from 2,2?- dimethyl-biphenyl-4,4?-diol

Liaw, Der‐Jang; Liaw, Been‐Yang

doi:10.1002/(sici)1099-0518(19991215)37:24<4591::aid-pola16>3.0.co;2-p

Cited by 15 publications

(12 citation statements)

References 11 publications

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“…This is because that Si603 resin has much oxydiphenylsilane group and oxypheny methylsilane group. We all know that oxydiphenylsilane group (-O-SiPh 2 -O-) was reported to exhibit a high thermal stability over 400°C [24][25][26]. It was reasonable that replacing triglycidyloxyphenylsilane group with oxydiphenyl-silane group (-O-SiPh 2 -O-) significantly improved the silicon-containing epoxy resins' thermal stability.…”

Section: Thermal Analysismentioning

confidence: 99%

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

Liu

Xiao

Deng

et al. 2014

J Therm Anal Calorim

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A novel polysiloxane (HPS) with epoxy and phenyl groups was synthesized by controlled hydrolysis and condensation of c-(2,3-epoxypropoxy)propytrimethoxysilane (KH560) and diphenyl silanediol. Besides, HPS was used as the compatibilizer of the miscible diglycidyl ether of bisphenol A (DGEBA)/methyl phenyl silicone resin (Si603) blend. The structure and effect of HPS were characterized by Fourier transform infrared spectra, nuclear magnetic resonance ( 1 H-NMR), differential scanning calorimetry, and scanning electron microscopy (SEM). The results showed that HPS could significantly improve the compatibility between epoxy resin (EP) and Si603 resin. In addition, the glass transition temperature (T g ) of the blend increases with increasing amount of Si603 from 129 to 151°C. The thermal stability of blending system was studied by thermogravimetric analysis, derivative thermogravimetric analysis and SEM. The results showed that the incorporation of Si603 into DGEBA resin not only obviously increased the thermal resistance, but also remarkably improved the flame retardancy. The high limiting oxygen index of the HPS/EP/Si603/DDM system at 31 is considered as excellent flame retardancy in the epoxy system.

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Section: Thermal Analysismentioning

confidence: 99%

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

Liu

Xiao

Deng

et al. 2014

J Therm Anal Calorim

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“…Preparations of polyaryloxydiphenylsilanes have been reported using molten35 and solution polymerization,36 through reacting aromatic diols and silane compounds. Molten polymerization gave high molecular weight products and high conversions.…”

Section: Resultsmentioning

confidence: 99%

“…Solution polymerization was therefore utilized in this study. It should be noted though that, in the solution polymerization of aromatic diols with diphenyldichlorosilane (DPDCS), Liaw36 et al reported trace amounts of water in the hydrophilic solvents could react with diphenyldichlorosilane (DPDCS) to break the stoichiometric balance of the monomers. Therefore, hydrophobic solvents, such as toluene and chlorobenzene, were found to give high polymerization conversions, high product yields and high molecular weight products.…”

Section: Resultsmentioning

confidence: 99%

“…Based on the above, in this study, novel compounds with high flame retardant efficiency were developed with the notion of improving the usual drawbacks encountered with the present flame retardant systems. First, our flame retardants are based on polyaryloxydiphenylsilanes, which were reported as having excellent thermal stability 34–36. Cyclic DOPO derivatives were incorporated into the flame retardant structure to maintaining both their thermal stability and flame retardant properties.…”

Section: Introductionmentioning

confidence: 99%

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Phosphorus‐containing polyaryloxydiphenylsilanes with high flame retardance arising from a phosphorus–silicon synergistic effect

Liu

Chiu

Chen³

2003

Polymer International

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Polyaryloxydiphenylsilanes were prepared from phosphorus-containing diols and diphenydichlorolsilane through solution polymerization. With a stoichiometric imbalance in feed monomers, the resulting polymers exhibited moderate melting points and good processing properties. The polymers prepared showed initial decomposition temperatures above 340°C, excellent thermal stability, high char yields at 850°C and very high limited oxygen index values of 56-59. The polymers' char yields and their (P þ Si) contents showed linear relationships.

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“…These studies clearly demonstrated the position of substitution (which induces noncoplanar structure) is more prominent than the side group effect in improving the solubility 8. It was also observed that the polymers with the 2,2′‐dimethyl‐4,4′‐biphenylene unit showed good thermal and mechanical properties because of the presence of the para ‐linked biphenylene unit 7, 9–12. Therefore, the incorporation of the noncoplanar 2,2′‐dimethyl‐4,4′‐biphenylene unit in the polymer backbone is expected to increase processability, as well as thermal and mechanical properties of the poly(ester‐imide)s.…”

Section: Introductionmentioning

confidence: 92%

Synthesis and characterization of new soluble poly(ester‐imide)s containing noncoplanar 2,2′‐dimethyl‐4,4′‐biphenylene unit

Liaw

Fan

Lin

et al. 2004

J of Applied Polymer Sci

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ABSTRACT:A new diimide-diacid chloride (3) containing a noncoplanar 2,2Ј-dimethyl-4,4Ј-biphenylene unit was synthesized by treating 2,2Ј-dimethyl-4,4Ј-diamino-biphenylene with trimellitic anhydride followed by refluxing with thionyl chloride. Various new poly(ester-imide)s were prepared from 3 with different bisphenols by solution polycondensation in nitrobenzene using pyridine as hydrogen chloride quencher at 170°C. Inherent viscosities of the poly(esterimide)s were found to range between 0.31 and 0.35 dL g Ϫ1 . All of the poly(ester-imide)s, except the one containing pendent adamantyl group 5e, exhibited excellent solubility in the following solvents: N, N-dimethylformamide, tetrahydrofuran, tetrachloroethane, dimethyl sulfoxide, N,N-dimethylacetamide, N-methyl-2-pyrrolidinone, m-cresol, o-chlorophenol, and chloroform. The polymers showed glass-transition temperatures between 166 and 226°C. The 10% weight loss temperatures of the poly(ester-imide)s, measured by TGA, were found to be in the range between 415 and 456°C in nitrogen.

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Synthesis and characterization of novel polyaryloxydiphenylsilane derived from 2,2?- dimethyl-biphenyl-4,4?-diol

Cited by 15 publications

References 11 publications

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

Phosphorus‐containing polyaryloxydiphenylsilanes with high flame retardance arising from a phosphorus–silicon synergistic effect

Synthesis and characterization of new soluble poly(ester‐imide)s containing noncoplanar 2,2′‐dimethyl‐4,4′‐biphenylene unit

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