Synthesis and characterization of Sn–3.5Ag–XZn alloy nanoparticles by the chemical reduction method

Lin, Chih‐Yung; Mohanty, Udit Surya; Chou, Jung-Hua

doi:10.1016/j.jallcom.2008.04.063

Cited by 19 publications

(10 citation statements)

References 30 publications

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“…However, transmission electron microscopy (TEM) images of Sn nanoparticles synthesized via chemical reduction indicated a finer particle size of several tens of nanometers. [9][10][11][12][13][14]16,17] Moreover, Hsiao et al [10] observed the particle size of Sn-3.0Ag-0.5Cu as a function of reaction time during reduction synthesis. They reported that Sn-3.0Ag-0.5Cu particles promptly grew up and saturated to several tens of nanometers after ~1 min, and named these the secondary particles, i.e., aggregates of asprecipitated primary particles.…”

Section: Resultsmentioning

confidence: 99%

“…[4,5] Although physical processes, such as the spark erosion or arc discharge method, have been studied during recent years, [6][7][8] the most promising process for fabricating solder nanoparticles is judged to be a chemical reduction method considering productivity and size uniformity. [9][10][11][12][13][14][15][16][17] Nevertheless, research into the effects of process parameters in the synthesis of Sn nanoparticles via chemical reduction is surprisingly rare.…”

Section: Introductionmentioning

confidence: 99%

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Effects of process parameters in synthesizing Sn nanoparticles via chemical reduction

Chee

Lee

2012

Electron. Mater. Lett.

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In order to prepare solder particles for fine pitch interconnections, Sn nanoparticles were synthesized via chemical reduction methods. A number of the process parameters, i.e., injection rate of a precursor solution, application of sonication, reaction temperature, types of reaction medium and capping agent, and drying temperature, are varied in order to study their effect on this process. Using a methanol solution containing 1,10-phenathroline monohydrate, the size of Sn nanoparticles collected after the synthesis decreases as the injection rate increases. An increase in the drying temperature strengthens the degree of agglomeration between Sn nanoparticles, and, in addition, the application of sonication accelerates the process of agglomeration and aggregation between nanoparticles during synthesis. Much smaller Sn nanoparticles are synthesized in diethylene-glycol solutions containing PVP, compared to the methanol solutions with 1,10-phenathroline monohydrate. In the synthesis using diethylene-glycol solutions, the Sn nanoparticle size increases quickly with the reaction temperature.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of process parameters in synthesizing Sn nanoparticles via chemical reduction

Chee

Lee

2012

Electron. Mater. Lett.

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“…Among the wide variety of metal nanoparticles, methods for fabrication of tin nanoparticles have been frequently proposed in recent years [3][4][5]. Tin is predominantly considered as a solder material, which has long been used as a representative interconnection material in microelectronic applications [6][7][8]. In particular, the application of tin nanoparticles in the form of paste or ink materials is preferred for the interconnection in microelectronic applications [9,10].…”

Section: Introductionmentioning

confidence: 99%

Synthesis of tin and tin oxide nanoparticles using liquid phase plasma in an aqueous solution

Lee

Park

Kim

et al. 2014

Microelectronic Engineering

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“…"Top-down" technique breaks the bulk materials into smaller particle sizes; one such example is ball milling [4]. "Bottom-up" technique implies assembling single atoms and molecules into larger nanostructures; examples are chemical reduction method [5][6][7] and arc discharged [8][9].…”

Section: Introductionmentioning

confidence: 99%

Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte

Foo

Siow

Jalar

2014

2014 IEEE International Conference on Semiconductor Electronics (ICSE2014)

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Solder printing faces challenges in print definition and sustainable volume transfer as the microelectronic industry migrates to smaller footprints. Nano-sized alloy particles mitigate these issues by modifying the solder formulation and rheology. We propose an electrodeposition method using reverse microemulsion (without reducing agent) as electrolyte to synthesize Sn-Ag-Cu solder alloy nanoparticle. SnCl 2 .2H 2 O, Ag 2 SO 4 and CuSO 4 are used as the precursor. N-hexane, TritonX-100 and n-hexanol are used as oil phase, surfactant and co-surfactant, respectively. Three volume ratios of aqueous to surfactant phase, W o are carried out namely: 0.20, 0.40 and 0.60 but only the ratio of 4.5:1.0 is able to synthesize the nano-sized SAC particles. Scanning electron microscopy shows the spherical SAC particles are well dispersed and their sizes range from 15 to 90 nm. X-ray diffraction spectra show the formation of Sn, Ag 3 Sn and Cu 6 Sn 5 without any oxide peaks in the synthesized nanoparticles; their absence suggests the effectiveness of the surfactants in protecting the alloy particles from oxidation. This electrodeposition method compares favourably to the microemulsion (with reducing agent) method in producing spherical and well-distributed nanosized solder particles.

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Synthesis and characterization of Sn–3.5Ag–XZn alloy nanoparticles by the chemical reduction method

Cited by 19 publications

References 30 publications

Effects of process parameters in synthesizing Sn nanoparticles via chemical reduction

Effects of process parameters in synthesizing Sn nanoparticles via chemical reduction

Synthesis of tin and tin oxide nanoparticles using liquid phase plasma in an aqueous solution

Synthesizing SnAgCu nanoparticles by electrodeposition of reverse microemulsion electrolyte

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