Synthesis and dielectric properties of polyarylene ether nitriles with high thermal stability and high mechanical strength

Tang, Hailong; Yang, Jian; Zhong, Jiachun; Zhao, Rui; Liu, Xiaobo

doi:10.1016/j.matlet.2011.06.007

Cited by 89 publications

(57 citation statements)

References 17 publications

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“…Tang et al 4647 reported that the dielectric properties of a polymer are relatively stable before T g , and increase abruptly when the temperature is higher than the T g of the polymer. When the temperature is below T g of the polymer, the macromolecular motion is restricted, and is relatively weak.…”

Section: Resultsmentioning

confidence: 99%

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Yang

Wei

et al. 2016

Sci Rep

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Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (Tg) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100–200 kHz and in the temperature range of 25–300 °C. The temperature coefficient of dielectric constant is less than 0.001 °C−1 even at 400 °C. By cycling heating and cooling up to ten times or heating at 300 °C for 12 h, the film shows good reversibility and robustness of the dielectric properties. This crosslinked PEN film will be a potential candidate as high performance film capacitor electronic devices materials used at high temperature.

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Section: Resultsmentioning

confidence: 99%

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Yang

Wei

et al. 2016

Sci Rep

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“…Acetone (2‐propanone), N , N ‐dimethylformamide (DMF, purity 99%) and 1‐methyl‐2‐pyrrolidinone (NMP, purity 99%) were purchased from Kelong reagent Co., Ltd., Chengdu, China. Polyarylene ether nitrile containing pendent carboxyl groups (CPEN) and BA‐ph were synthesized in our laboratory . The model of the GF fabric was EW170‐100 purchased from Shenyang Gaote glass fiber Co., Shenyang, China.…”

Section: Methodsmentioning

confidence: 99%

Design of the phthalonitrile‐based composite laminates by improving the interfacial compatibility and their enhanced properties

Ren

Lei

Pan

et al. 2017

J of Applied Polymer Sci

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Phthalonitrile containing benzoxazine (BA‐ph) and cyanate ester (CE) were chosen as the thermosetting matrix and the glass fiber (GF) reinforced laminates formed at low temperature were designed. The polyarylene ether nitriles containing pendent carboxyl groups (CPEN) was selected to modify the interfacial interaction between the resin matrix and GFs. Two methods of introducing CPEN were compared and the effects of CPEN on curing behaviors and properties of the composites were investigated. Results showed that with the CPEN, exothermic peaks shifted to lower temperature and curing temperatures of BA‐ph/CE decreased slightly. The mechanical and thermal properties of GF‐reinforced composites were discussed and the results indicated that the composites of modified GFs with CPEN exhibited outstanding mechanical properties, higher glass transition temperature (Tg > 290 °C) than that of composites composed of CPEN mixed with BA‐ph/CE. Moreover, GF‐reinforced composites showed stable dielectric constants (3.8–4.5) and low dielectric loss (0.005–0.01), which were independent of the frequency. In sum, the various methods of the introduction of CPEN in the GF‐reinforced composites may provide a new route to prepare improved composites, meanwhile, composites with outstanding processability and excellent mechanical and thermal properties are expected to be widely applied in the fields of high‐performance structural materials. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 45881.

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“…Despite the advantages of the PEN, the integrated circuit need low dielectric constant materials at high frequency [9]. Usually, the dielectric constant of PEN is in the range of 3.8-5.2 [10], which are unacceptable for the applications at high frequency [11].…”

Section: Introductionmentioning

confidence: 99%

Low dielectric permittivity and high thermal stability composites based on crosslinkable poly (arylene ether nitrile) and hollow glass microsphere

Zou

Zhan

Zhao

et al. 2012

J Mater Sci: Mater Electron

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Crosslinkable poly (arylene ether nitrile)/hollow glass microsphere (PEN/HGM) composites with relative low dielectric permittivity and high thermal stability were prepared by a solution mixing and thermal compression method. For achieving this purpose, HGM were tight embedded in network, which were formed by crosslinking reaction of PEN end-capped with phthalonitrile. Compared to pure PEN, the dielectric constant of the resulting composite with 15 wt% of HGM reduced from 4.1 to 2.7 at 100 kHz, and the dielectric loss decreased from 2.0 9 10 -2 to 0.8 9 10 -2 at 100 kHz. Furthermore, the as-prepared composites showed significant enhancement in glass transition temperature (increased by 64°C) and onset thermal degradation temperature (increased by 41°C). Therefore, such composites were expected to find their applications area such as integrated circuit where needs low dielectric constant, low dielectric loss and high thermal stability.

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Synthesis and dielectric properties of polyarylene ether nitriles with high thermal stability and high mechanical strength

Cited by 89 publications

References 17 publications

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Design of the phthalonitrile‐based composite laminates by improving the interfacial compatibility and their enhanced properties

Low dielectric permittivity and high thermal stability composites based on crosslinkable poly (arylene ether nitrile) and hollow glass microsphere

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