2001
DOI: 10.1002/app.1999.abs
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Synthesis and properties of PMR type poly(benzimidazopyrrolone‐imide)s

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Cited by 3 publications
(7 citation statements)
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“…According to Figure 10, the onset temperature of the reduction of storage modulus ( G ′) was at 250°C for the molded plate without postcuring, whereas that of the postcured molded plate was increased to 350°C (i.e., the postcured 3,5‐PPBP‐20 molded plate showed an almost constant storage modulus until the temperature reached 350°C). In particular, its tan δ value was remarkably enhanced and the peak temperature measured in its tan δ curve was at 413.5°C, defined as the glass‐transition temperature ( T g ) of the materials16; meanwhile, the T g value the of 3,5‐PPBP‐25 molded plate was at 389.13°C. The DMA results presented in Figures 8, 9, and 10 demonstrate that the monomer molar ratio based on the PPBP‐20 molded plate would be suitable for the preparation of PMR‐type matrix resins consisting of pyrrolone, benzimidazole, and pyridine structures.…”
Section: Resultsmentioning
confidence: 99%
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“…According to Figure 10, the onset temperature of the reduction of storage modulus ( G ′) was at 250°C for the molded plate without postcuring, whereas that of the postcured molded plate was increased to 350°C (i.e., the postcured 3,5‐PPBP‐20 molded plate showed an almost constant storage modulus until the temperature reached 350°C). In particular, its tan δ value was remarkably enhanced and the peak temperature measured in its tan δ curve was at 413.5°C, defined as the glass‐transition temperature ( T g ) of the materials16; meanwhile, the T g value the of 3,5‐PPBP‐25 molded plate was at 389.13°C. The DMA results presented in Figures 8, 9, and 10 demonstrate that the monomer molar ratio based on the PPBP‐20 molded plate would be suitable for the preparation of PMR‐type matrix resins consisting of pyrrolone, benzimidazole, and pyridine structures.…”
Section: Resultsmentioning
confidence: 99%
“…For preparation of a PPBP molding plate, an adequate molten flow was required to ensure that the molten fluid would fill out the die. There are two converse processes affecting the flow behavior of the molten fluid in thermal processing15, 16: (1) melting of the molding powder with low molecular weight to yield a flowing fluid and (2) chemical crosslinking and chain extending caused by the reaction of end caps. The key factors in thermal processing were the die temperature and applied pressure, which were controlled carefully to produce a molded plate with high quality.…”
Section: Resultsmentioning
confidence: 99%
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“…To understand the thermal decomposition behavior of the resulted polymers, the thermal degradation kinetics of polyimide films PI‐A TT and PI‐B TT was studied by DTGA 39, 40. The DTGA curves (Fig.…”
Section: Resultsmentioning
confidence: 99%
“…Bell prepared poly(pyrrolone imides)s (PPyIs) for potential use in aerospace by copolymerizing tetraamine/diamine and dianhydride to increase the toughness of PPys . Yang coworkers prepared thermosetting PMR type PPyIs by copolymerizing tetraamine/diamine, diester of diphthalic acid, and monoester of dicarboxylic acid . Burns and Koros prepared PPyIs by copolymerizing tetraamine/diamine and dianhydride to control the permeability and selectivity .…”
Section: Introductionmentioning
confidence: 99%