Synthesis, characterization, and properties of low viscosity tetra‐functional epoxy resin N,N,N′,N′‐ tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane

Abstract

Tetra-functional epoxy resin N,N,N 0 ,N 0 -tetraglycidyl-3,3 0 -diethyl-4,4 0 -diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25 C was 7.2 PaÁs, much lower than that of N,N,N 0 ,N 0 -tetraglycidyl-4,4 0 -diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4 0 -diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF 3 -MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. V C 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 40009.

Enhancement in Mechanical, Thermal, and Dielectric Properties of Functionalized Graphene Oxide Reinforced Epoxy Composites

“…These resins are being used in coatings, adhesives, hardware components, semiconductor encapsulation, and electronic circuit board materials due to their high performance properties such as tensile strength, high stiffness, exceptional electrical strength, and excellent chemical resistance, etc. [1][2][3] But, epoxy resins are brittle in nature with poor strength and toughness. 4,5 In order to overcome this problem, we need to incorporate modifiers (like polymer based nano-fillers) into the epoxy resin to ensure a remarkable enhancement in the mechanical and thermal properties of epoxy resins.…”

Novel phthalazinone‐bearing tetrafunctional epoxy: Synthesis, characterization, and their toughening application for TGDDM system

“…[4][5][6][7] Simultaneously, mechanism for amine and epoxy system were systematically investigated as well .3,8 However, previous works usually illustrated TGDDM/DDS systems with glass transition temperature (T g ) ranging from 218°C to 280°C and storage modulus varying between 2000 and 4000 MPa, which were greatly dependent on the curing procedure and the amount of amine. Meanwhile, the cured TGDDM/DDS [9][10][11][12][13][14][15][16] had elevated storage modulus while sacrificing T g , and vice versa as shown in Table 1.…”

“…Mustata took modification from the aliphatic chain, which is located at the center of TGDDM molecule structure, in turn to synthesize the tetraglycidyl of diamino diphenylether (TGDDE) and tetraglycidyl of diaminobibenzyl (TGDBBz). Zheng synthesized epoxy resin named TGDEDDM, and it had carried out the comparisons of heat resistance and flexural strength between TGDDM and TGDEDDM. The structures of all the compounds mentioned above could be found in Scheme 1.…”