Synthesis of a novel biphenyl epoxy resin and its hybrid composite with high thermal conductivity

Na, T.; Che, Songtian; Sun, Youli; Liu, X.; Hao, Juanyuan; Zhao, Chengji

doi:10.1002/app.47078

Cited by 13 publications

(8 citation statements)

References 13 publications

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“…The synthesis of inherently ductile epoxy network as measured by their resistance to deformation however is less reported and is the subject of this study. Common strategies have been to incorporate structures that are inherently rigid, such as liquid crystalline or highly aromatic, while others have sought to build a combination of both rigid and flexible features into a network . Highly aromatic structures will generally have excellent mechanical and thermal properties and resistance to solvent ingress, but are also notoriously difficult to process.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Tri‐Aryl Methane Epoxy Resin Isomers and Their Cure with Aromatic Amines

Reyes

Issazadeh

Zhang

et al. 2020

Macro Materials & Eng

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The synthesis of inherently ductile epoxy network as measured by their resistance to deformation however is less reported and is the subject of this study. Common strategies have been to incorporate structures that are inherently rigid, [8] such as liquid crystalline [9,10] or highly aromatic, [11,12] while others have sought to build a combination of both rigid and flexible features into a network. [13][14][15] Highly aromatic structures will generally have excellent mechanical and thermal properties and resistance to solvent ingress, but are also notoriously difficult to process. As a result, the following studies are a reflection of the variety of strategies attempting to break this paradigm. Karimata et al. (2016) [16] synthesized a tri-aryl di-epoxide monomer linked by flexible carbosilane segments. After curing with an aromatic amine, the glass transition temperature (T g ) of the network was still below room temperature, suggesting potential application as a reactive flexibilizer. Wan et al. (2016) [17] synthesized a bioderived eugenol epoxy resin, essentially a tri-aryl ether linked epoxy resin with a superior modulus, hardness, and char yield compared with a related epoxy amine cured network. It also had a higher creep displacement attributed to increased chain mobility in the glassy state. Yu et al. (2018) [18] combined a rigid carboxamide structure with flexible aliphatic ethers to synthesize an amine, which when cured with an epoxy resin reported improvements in tensile strength, failure strain, and impact strength without any commensurate deterioration in flexural strength. Varley et al. (2019) synthesized highly aromatic ether-linked epoxy monomers and amines, exploring the impact of substitution patterns on the properties and processability. [19] Improvements in yield and failure strain, referred to as distortional behavior, were attributed to an increase in energy dissipated through phenylene rotations available to para-substituted amine or epoxy resins. [20,21] In this work, two tri-aryl epoxy resins containing flexible methylene linkages instead of ether linkages and a rigid bi-aryl epoxy resin have been synthesized and compared with the commercially available diglycidyl ether of bis phenol F (BisF). A central hypothesis of this work is that flexibility or molecular mobility within a rigid network may impart enhanced distortional behavior of the epoxy amine network as measured by compression. The epoxy resins synthesized were bis[(glycidyloxy)phenyl)]-m-xylene (BGOPmX), bis[(glycidyloxy)phenyl)]-p-xylene (BGOPpX), and In this work, two tri-aryl and one bi-aryl epoxy resin, bis[(glycidyloxy)phenyl)]m-xylene (BGOPmX), bis[(glycidyloxy)phenyl)]-p-xylene (BGOPpX), and bis(glycidyloxy) biphenyl (BGOBP) are synthesized and cured with methylene dianiline and 4,4′-diamino diphenyl sulfone. Structure, property, and processing relationships are investigated and compared against diglycidyl ether of bis-phenol F epoxy resin to better understand the impact of rigid and flexible subunits within the network st...

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Section: Introductionmentioning

confidence: 99%

Synthesis of Tri‐Aryl Methane Epoxy Resin Isomers and Their Cure with Aromatic Amines

Reyes

Issazadeh

Zhang

et al. 2020

Macro Materials & Eng

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“…With continuingly increasing power of electronic devices, the amount of heat generated is sharply increasing. [1][2][3][4][5] Owing to roughness in morphology, just a small fraction of the apparent surface area will have an actual contact when two solid surfaces are joined. [6][7][8][9][10] The rest of the area will be separated by an air-filled gap, and since the thermal conductivity of air (0.026 W/mK) is about four orders of magnitude lower than that of metals, heat transfer across the interface through air is negligible.…”

Section: What Is Thermal Interface Material?mentioning

confidence: 99%

Recent Advances in Thermal Interface Materials

Zhou¹,

Wu²,

Long³

et al. 2020

ES Mater.Manuf.

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In recent years, miniaturization and integration have become the development trends of electronic devices. With the power of electronic devices continuing to increase, the amount of heat generated is sharply increasing. Thermal interface material (TIM) can effectively improve heat transfer between two solid interfaces, and it plays an important role in the performance, service life and stability of electronic devices. In this case, higher requirements are put forward for thermal management, so much attention is also attached to the innovation and optimization of TIM. In this paper, recent research development of TIM is reviewed. Rheology-based modeling and design are discussed for the widely used polymeric TIMs. It is discussed for the effects of thermal conductive fillers on the properties of composites. Many studies have shown that some polymers filled with high thermal conductivity and low loss ceramics are well suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been paid to the preparation of polymeric composites with high thermal conductivity for the application in electronic packaging. Finally, the problems are also discussed and the research directions of TIM in the future are prospected.

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“…At present, the synthesis process for such intrinsic thermal conductive polymer material is fairly complicated and hard to proceed. 21,22 The other one is adding high thermal conductivity filler to the polymer matrix. Its preparation procedure is simple, large operating space, and combined with the advantages of functional inorganic filler and polymer matrix, thermal conductive polymer materials prepared have been widely used, has become an important direction of the development of high thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

“…One is to synthesize bulk polymers with high crystallinity or orientation. At present, the synthesis process for such intrinsic thermal conductive polymer material is fairly complicated and hard to proceed 21,22 . The other one is adding high thermal conductivity filler to the polymer matrix.…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity of poly(aryl ether nitrile ketone)/functionalized boron nitride composites by electrospinning–hot press technique

Wang

et al. 2022

J of Applied Polymer Sci

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In this study, poly(aryl ether nitrile ketone)/functionalized boron nitride (PEK-CN/f-BN) composites fibers were prepared by solution blending followed by electrospinning technique. And the thermally conductive PEK-CN/f-BN nanocomposites were fabricated via hot press method. Octadecyltrimethylammonium Bromide (OTAB) was performed to functionalize the surface of boron nitride (BN) fillers, which were utilized as thermally conductive fillers to fabricate the corresponding PEK-CN/BN composites. The thermal conductivity coefficient (λ) of the PEK-CN/f-BN composites (25 wt% f-BN) was 0.702 W/mK, and the PEK-CN/ BN composites (25 wt% unfunctionalized BN) was 0.649 W/mK, whose λ is more than 200% higher than the λ of pure PEK-CN (0.251 W/mK). Meantime, compared to the pure PEK-CN, the glass-transition temperature (T g ) of the PEK-CN/f-BN composites was increased from 228.10 to 232.98 C, and the thermal stability of the PEK-CN/f-BN composites has been improved as well. It was also noticed that, under the ideal electrospinning conditions, when the content of BN and f-BN attached to 25 wt%, the storage modulus (E 0 ), loss modulus (E 00 ), and dielectric loss tangent (tan δ) values of the PEK-CN/BN composites and PEK-CN/f-BN composites were higher than that of pure PEK-CN.

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Synthesis of a novel biphenyl epoxy resin and its hybrid composite with high thermal conductivity

Cited by 13 publications

References 13 publications

Synthesis of Tri‐Aryl Methane Epoxy Resin Isomers and Their Cure with Aromatic Amines

Synthesis of Tri‐Aryl Methane Epoxy Resin Isomers and Their Cure with Aromatic Amines

Recent Advances in Thermal Interface Materials

Enhanced thermal conductivity of poly(aryl ether nitrile ketone)/functionalized boron nitride composites by electrospinning–hot press technique

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