Synthesis of epoxy acrylate and preparation of dual-curable ECAs based on conductive ceramic powders

Near-infrared light induced curing of electrically conductive adhesive assisted by upconversion particles

“…It was found that the sealant could be cured completely, and the adhesive strength could reach 50 kgf cm À2 . Zhang et al 12 synthesized a series of epoxy acrylates with different esterification rates, then added modified BaTiO 3 ceramic powder fillers as conductive fillers to prepare a UV-thermal dual-curing ECA. It was found that the gel content of the ECA was as high as 98.91%, indicating that the ECA was cured completely.…”

Improving water resistance and mechanical properties of waterborne acrylic resin modified by 3,3′,5,5′-tetramethyl-4,4′-biphenyl diglycidyl ether

“…Zhang et al [16] synthesized epoxy acrylic resins with different esterification rates for electrically conductive adhesives by the reaction of E-51 and α -methacrylic acid at 110 O C. Lin et al [17] prepared epoxy acrylic resin with the molar ratio of epoxy group to carboxyl group of 1:0.25 to provide raw materials for the later synthesis of epoxy acrylic copolymer. Graft copolymerization is to combine epoxy resin with acrylic resin by covalent bond.…”

UV–thermal‐cured cycloaliphatic epoxy composites with enhanced mechanical properties via Ca2+‐modified nanocrystalline cellulose

“…2,3 However, the application of UV curing has been severely limited by the low curing depth, color blocking effect and complicated shape of products. Therefore, in the past few years, to synergistically achieve high curing efficiency and sufficient curing of resins, the UV-thermal dual-curing technique [4][5][6] has been proposed and applied for opaque materials, complex substrates, super-thick coatings and colored coatings. Cycloaliphatic epoxy resin (CAE) 7,8 is one of the most used UV-cured resins, which has been widely used in semiconductor sealants, LED encapsulation adhesives, bottom filler adhesives and coatings due to its unique advantages such as good dielectric property, small deformation shrinkage, favorable dimensional stability, high heat resistance and excellent weather resistance.…”