“…The deposition rate of Si films decreased with increasing pressure, giving values of 3, 2.3, 1.5, 1.3, and 1 nm/s at 0.3, 0.5, 1, 1.5, and 2 Torr, respectively. This dependence of deposition rate on pressure is different from previous reports, wherein the deposition rate was found to increase with process pressure during the deposition of Si films by HWCVD. ,, This is due to the difference in the range of the process pressure used in the experiment. In the previous reports, most Si HWCVD processes were done at pressures less than 0.5 Torr.…”