2004
DOI: 10.1016/j.jorganchem.2004.01.033
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Synthesis of poly{[bis(diethynylphenyl)silylene]phenylene}s with highly heat-resistant properties and an application to conducting materials

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Cited by 21 publications
(13 citation statements)
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“…1b). These results were in agreement with the structures of the silicon-containing arylacetylenic monomers [20][21][22][23].…”
Section: Resultssupporting
confidence: 87%
“…1b). These results were in agreement with the structures of the silicon-containing arylacetylenic monomers [20][21][22][23].…”
Section: Resultssupporting
confidence: 87%
“…Similar cross-linking reactions have been observed previously also for other ethynylphenyl-substituted polysilylenephenylenes including polymer 1. 18,19 The TGA data obtained for 2a and 2b are inferior to those of polymer 1, reported previously.…”
contrasting
confidence: 65%
“…[16][17][18][19] Of these, poly]=bis diethynylphenyl silylene? phenylene_ 1 in Chart 1 exhibited the best heat-resistant properties in nitrogen with the temperature of 5ಚ weight loss Td 5 ࢼ791c C and the total weight loss at 1000c Cࢼ6ಚ of the initial weight.…”
Section: -15mentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9][10][11] Some silicon-containing thermosetting polymers with ethynyl or ethynylene groups have been explored and developed. Itoh et al [12][13][14][15] prepared poly(phenylsilyleneethynylene-1,3-phenyleneethynylene) [-Si(Ph)H-C C-C 6 H 4 -C C-] n (abbreviated MSP) by a dehydrogenative coupling polymerization reaction between phenylsilane and m-diethynylbenzene in the presence of magnesium oxide.…”
Section: Introductionmentioning
confidence: 99%