“…However, these approaches involve high processing temperatures, complex procedural steps, and long processing times. With this in mind, plasma‐enhanced CVD (PECVD) has been investigated to achieve a high doping/deposition level at low temperatures; this method 40 is widely preferred to avoid the use of potentially dangerous precursors 41 . Compared with the thermal‐CVD method, the presence of accelerated energetic electrons, excited molecules, atoms, free radicals, photons, and other active species in the plasma offers significant advantages such as a relatively low substrate temperature and short processing time 40 …”