2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) 2012
DOI: 10.1109/rfit.2012.6401626
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System integration using silicon-based integrated passive device technology

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Cited by 7 publications
(1 citation statement)
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“…Several conventional technologies, such as printed circuit boards and low-temperature co-fired ceramic technology, cannot meet the requirements for this continuing trend [1,2]. Along with the advent of integrated passive device (IPD) technology, the above-mentioned issues were skillfully conquered, and IPD technology offered compatibility with active devices to make an essential system in both a package and a system on chip [3][4][5][6]. Furthermore, the bandpass filter (BPF) is an essential device in wireless and mobile communication systems.…”
Section: Introductionmentioning
confidence: 99%
“…Several conventional technologies, such as printed circuit boards and low-temperature co-fired ceramic technology, cannot meet the requirements for this continuing trend [1,2]. Along with the advent of integrated passive device (IPD) technology, the above-mentioned issues were skillfully conquered, and IPD technology offered compatibility with active devices to make an essential system in both a package and a system on chip [3][4][5][6]. Furthermore, the bandpass filter (BPF) is an essential device in wireless and mobile communication systems.…”
Section: Introductionmentioning
confidence: 99%