Systematic evaluation of cyanate ester/ epoxidized cresol novolac copolymer resin system for high temperature power electronic packaging applications

Li, Jiaxiong; Ren, Chao; An, Dong; Ren, Yanjuan; Moon, Kyoung‐Sik; Wong, Ching‐Ping

doi:10.1016/j.polymer.2020.122454

Cited by 24 publications

(19 citation statements)

References 42 publications

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“… 27 Many new types of epoxy resins ( e.g., biphenyl and multiaromatic resins) with improved performance were developed in recent years. 28 − 30 Here, we selected the OCN epoxy resin polymer cured with phenol novolac (PN) resin as the most basic example of an adhesive component.…”

Section: Methodsmentioning

confidence: 99%

“…The first widely used epoxy resin in semiconductor packaging applications was ortho -cresol novolac (OCN), , which is electrically, mechanically, and thermally suitable for the encapsulation process . Many new types of epoxy resins ( e.g., biphenyl and multiaromatic resins) with improved performance were developed in recent years. − Here, we selected the OCN epoxy resin polymer cured with phenol novolac (PN) resin as the most basic example of an adhesive component.…”

Section: Methodsmentioning

confidence: 99%

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Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

Tsurumi¹,

Tsuji

Masago

et al. 2021

ACS Omega

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Clarification of adhesive interactions in semiconductor packages can improve reliability of power electronics. In this study, the adhesion interfaces between the epoxy molding compound and Cu-based lead frames were analyzed using the density functional theory. A resin fragment was prepared based on the polymer framework formed in the curing reaction of epoxy cresol novolac (ECN) and phenol novolac (PN), which are typical molding materials. The resin fragment was optimized on the surfaces of Cu and Cu 2 O. We calculated the charge density differences for adhesion structures and discussed the origin of adhesive interactions. The ECN–PN fragment’s adhesion to the Cu surface relied mainly on dispersion forces, whereas in the case of Cu 2 O, the resin bonded chemically to the surface via (1) σ-bonds formed between the ECN–PN’s OH group oxygen and coordinatively unsaturated copper (Cu CUS ) and (2) hydrogen bonds between resin’s OH groups and coordinatively unsaturated oxygen (O CUS ) located close to to Cu CUS , resulting in a stable adhesive structure. The energy required to detach the resin fragment from the optimized structure was determined using the nudged elastic band method in each model of the adhesive interface. Morse potential curve was used to approximate the obtained energy, and the energy differentiation by detachment distance yielded the theoretical adhesive force. The maximum adhesive stress was 1.6 and 2.2 GPa for the Cu and Cu 2 O surfaces, respectively. The extent to which the ECN–PN fragment bonded to the Cu 2 O surface stabilized was 0.5 eV higher than in the case of the Cu surface.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

Tsurumi¹,

Tsuji

Masago

et al. 2021

ACS Omega

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“…Extensive works done by Shimp, , Ising, , Bauer and Bauer, − and Hamerton − have laid solid foundations and paved the way for us to utilize the fascinating properties of CE/EP copolymers with desired processability and high-temperature performances. Aiming at enhancing the high-temperature stability of epoxy for EMC applications in power packages, we have been thoroughly investigating selected CE/EP systems to gather information including their intrinsic properties and degradation pattern under high-temperature aging conditions. − Counterintuitively, the high T g formulations with rich CE feeds normally experienced larger weight losses and severe blistering in the aging studies. In our previous work, the hydrolysis degradation of cyanate groups and decomposition of carbamates were identified to be responsible for this premature failure in these resins.…”

Section: Introductionmentioning

confidence: 74%

Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature

Ren

Sun

et al. 2021

ACS Appl. Mater. Interfaces

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The rapid progress in silicon carbide (SiC)-based technology for high-power applications expects an increasing operation temperature (up to 250 °C) and awaits reliable packaging materials to unleash their full power. Epoxy-based encapsulant materials failed to provide satisfactory protection under such high temperatures due to the intrinsic weakness of epoxy resins, despite their unmatched good adhesion and processability. Herein, we report a series of copolymers made by melt blending novolac cyanate ester and tetramethylbiphenyl epoxy (NCE/EP) that have demonstrated much superior hightemperature stability over current epoxies. Benefited from the aromatic, rigid backbone and the highly functional nature of the monomers, the highest values achieved for the copolymers are as follows: glass-transition temperature (T g ) above 300 °C, decomposition onset above 400 °C, and char yield above 45% at 800 °C, which are among the highest of the known epoxy chemistry by far. Moreover, the high-temperature aging (250 °C) experiments showed much reduced mass loss of these copolymers compared to the traditional high-temperature epoxy and even the pure NCE in the long term by suppressing hydrolysis degradation mechanisms. The copolymer composition, i.e., NCE to EP ratio, has found to have profound impacts on the resin flowability, thermomechanical properties, moisture absorption, and dielectric properties, which are discussed in this paper with in-depth analysis on their structure−property relationships. The outstanding high-temperature stability, preferred and adjustable processability, and the dielectric properties of the reported NCE/EP copolymers will greatly stimulate further research to formulating robust epoxy molding compounds (EMCs) or underfill for packaging next-generation high-power electronics.

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“…3,4 At the same time, due to the highly symmetrical structure of the triazine ring produced by the trimerization reaction of CE resin, the CE resin not only has a large volume shrinkage but also exhibits brittleness, which seriously affects the application of the CE resin in various fields. 5,6 In order to solve these problems, researchers proposed to blend or copolymerize with other resins by means of introducing irregular molecular structure, reducing the shrinkage related residual stress and the crack sensitivity, such as epoxy resin, 7,8 bismaleimide, 9,10 and benzoxazine. 11,12 It is well-known that benzoxazine is a novel developed phenolic resin, which has the characteristics of excellent thermal properties, low water absorption, no byproduct formation, and very low shrinkage during the curing process, and good mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Curing kinetics and mechanical properties of cyanate ester/hyperbranched benzoxazine copolymers

Wang

Qin

et al. 2022

Polymers for Advanced Techs

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In the current study, three different curing kinetics models were used to analyze the curing kinetics of hyperbranched benzoxazine (HB‐PED230) and monofunctional benzoxazine (P‐a) modified cyanate ester (CE) resin by non‐isothermal differential scanning calorimeter. Moreover, the effects of two benzoxazines on the copolymerization behavior, thermal stability, and mechanical properties of CE resin were studied. Compared with the P‐a modified CE resin, HB‐PED230 greatly reduces the curing temperature of the copolymer, while improving the bending strength and impact strength. The curing temperature of HB‐PED230 modified CE resin was 79°C lower than neat CE resin, while the CE/P‐a blended resin only reduce 48°C. As the amount of HB‐PED230 increased, the flexural strength and flexural modulus of the copolymers were improved. Surprisingly, when 7 wt% of HB‐PED230 was added, the impact strength of the copolymer was increased by 177.6%, implying that the toughness of CE resin had been greatly improved. Moreover, the fracture morphology of the copolymers was observed by scanning electron microscope. In summary, a small amount of HB‐PED230 blending can effectively improve the overall performance of CE resin.

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Systematic evaluation of cyanate ester/ epoxidized cresol novolac copolymer resin system for high temperature power electronic packaging applications

Cited by 24 publications

References 42 publications

Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature

Curing kinetics and mechanical properties of cyanate ester/hyperbranched benzoxazine copolymers

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