Ta-SiC Thin Film Resistors for Highly Reliable Thermal Printing Heads

Nunomura, K.; Koyama, N.; Matsubara, T.

doi:10.1109/tchmt.1983.1136217

Cited by 8 publications

(2 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Protective layers are chosen from materials such as SiO 2 , Ta 2 O 5 [88,89], or SiC [89]. For reliability, the wear life of a protective layer must exceed the cycle life of the resistor and other head parts.…”

Section: Thermal Print Transducersmentioning

confidence: 99%

Imaging Technology, 2. Copying and Nonimpact Printing Processes

Pai

Melnyk

Hann³

et al. 2011

Ullmann's Encyclopedia of Industrial Chemistry

View full text Add to dashboard Cite

The article contains sections titled: 1. Office Copying and Printing 1.1. Electrophotography 1.1.1. Photoreceptor 1.1.2. Corotron Charging 1.1.3. Light Exposure 1.1.4. Image Development 1.1.5. Image Transfer and Fusing 1.1.6. Photoreceptor Cleaning and Erase 1.1.7. Other Electrophotographic Imaging Systems 1.2. Thermographic Printing 1.2.1. Thermal Print Transducers 1.2.2. Resistive Ribbon Technology 1.2.3. Imaging Materials and Mechanisms 1.2.4. Comparison of Thermal Technologies 1.3. Ink‐Jet Printing 1.3.1. Continuous Ink Jet 1.3.2. Impulse (Drop‐on‐Demand) Ink Jet 1.3.3. Ink‐Jet Nozzle Orifice 1.3.4. Ink‐Jet Inks 1.3.5. Colorants Used in Ink Jet Inks 1.3.6. Color Printing with Ink Jets 2. Technical Copying 2.1. Diazotyping 2.1.1. Photolysis 2.1.2. Coupling Reaction 2.1.3. Production of Diazotyping Material 2.1.4. Processing 2.2. Other Photochemical Systems 2.3. Silver Process 2.3.1. Black and White Copying Materials Based on Silver Diffusion Transfer Technology 2.3.2. Modern Lithographic Printing Applications 2.3.3. Color‐Copying Materials Based on Dye Diffusion Chemistry 3. Microfilms and Microfiches 3.1. Diazotyping 3.2. Vesicular Film

show abstract

Section: Thermal Print Transducersmentioning

confidence: 99%

Imaging Technology, 2. Copying and Nonimpact Printing Processes

Pai

Melnyk

Hann³

et al. 2011

Ullmann's Encyclopedia of Industrial Chemistry

View full text Add to dashboard Cite

show abstract

“…The TFRs consisted of CrSi 2 (48 wt%)-Cr (27 wt%)-SiC (25 wt%) composites [8], with thickness ranging from 30 to 40 Å. As mentioned in [23] and [24], silicon carbide (SiC) was used to improve the thermal stability of the fabricated TFR. The thin film, which consists of microcrystal SiCr and amorphous SiC, is robust at the high temperatures because of its thermally stable structure.…”

mentioning

confidence: 99%

Process Optimization of Integrated SiCr Thin-Film Resistor for High-Performance Analog Circuits

Kwon

Seol

Hong

et al. 2014

IEEE Trans. Electron Devices

View full text Add to dashboard Cite

We investigated the characteristic variation of an integrated thin-film resistor (TFR), which is composed of silicon chromium (SiCr), according to process conditions and its effects on analog circuits. To improve TFR properties, such as temperature coefficient of resistance (TCR) and mismatch, the integrated TFR was examined under various process conditions. First, the sputtering power and the annealing temperature were optimized to control the TCR property. Secondly, the etching time and the dummy pattern were optimized to enhance the mismatch property. The measured TCR is −3.9 ppm/°C and the calculated mismatch slope from the standard deviation of resistance mismatch is 0.34%·µm. These results show that the fabricated TFR had near-zero TCR and a high matching constant. To verify the TFRs effects on analog circuits, low-pass filters (LPFs) were fabricated and measured as a test vehicle; the use of the optimized resistor considerably improved the performance of the resulting LPFs.Index Terms-Integrated thin-film resistor (TFR), low-pass filter (LPF), mismatch, silicon chromium (SiCr), temperature coefficient of resistance (TCR), TFR dummy pattern, TFR.

show abstract