Taguchi Analysis of Relation Between Tensile Strength and Interfacial Phases Quantified via Image Processing

Image Processing-Based Analysis of Temperature Dependent Interlayer in Brazed Fe-Cr-Al Alloy (Fecralloy®) with Ni-Based Filler Metal

“…The formation of Cr x B y phase at the interface of chromium and boron has been confirmed by researchers [17][18][19]25]. The formation of Cr x B y is one of important factors in that Cr x B y is brittle and affects the bond strength [18,19].…”

“…Metal grains are visible in Fecralloy part, but not in filler metal. In case of the bonding between STS304 and MBF20, the interlayer is a region where Cr x B y phase exists, which is a factor determining the strength of bonding [18,19]. For the detail analysis to understand the bonding interlayer between Fecralloy and MBF20, SEM-EDS was used and the images for brazing at 1000 • C are shown Figure 8.…”

“…In addition, by using brazing bonding, the bonding between metal and non-metal, less thermal distortion, and cost-effective complex bonding are possible [14]. There have been various research on brazing bonding for metal and metal [15][16][17][18][19]. Metal and non-metal brazing was also performed that Al 2 O 3 and 304 stainless steel brazed using 97(Ag28Cu)3Ti filler [20,21], Fecralloy/copper foil/silicon nitride brazing bonding [22], and boron nitride with steel bonding [23] were performed.…”

“…To evaluate the bonding quality for brazing bonding, there were studies [15,16,[18][19][20][21][22] that analyzed the materials of the bonding cross section by varying bonding temperatures and the rates of temperature rise, which are important factors determining bonding quality. Most of those studies showed the results of the relationship between the changing factors (e.g., bonding temperature, the rate of temperature rise, or bonding duration time) and tensile strength at the junctions.…”

“…The acquired images showed the intensities of the constituent of materials across the bonding layers, and they were used to investigate bonding qualities. However, the research to quantify the penetration depth of materials in the bonding process by analyzing the change of the border line of filler metal and the distribution of newly formed phase distribution has been rare even though they are important factors to determine the bonding characteristic and quality [19,24]. In addition, there have been few attempts to analyze the Cr x B y and Ni x Al y phases that determine the bonding quality by quantifying the distribution of materials using image processing of SEM-EDS images.…”