Abstract:Tailoring the thermal expansion coefficient of negative thermal expansion (NTE) materials to achieve near-zero thermal expansion has attracted great attention recently. Here, LiFe diatoms are adopted to substitute Cu in Cu 2 P 2 O 7 oxide to design Li−O−P and Fe−O−P linkages, with the stronger bond strength of Li−O and Fe−O compared to Cu−O and hence lowering the bond strength of P−O. With increasing the diatomic LiFe in (LiFe) 0.5x Cu 2−x P 2 O 7 , new Raman bands corresponding to LiFeP 2 O 7 appear and the N… Show more
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