2017 27th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS) 2017
DOI: 10.1109/patmos.2017.8106979
|View full text |Cite
|
Sign up to set email alerts
|

Temperature and process-aware performance monitoring and compensation for an ULP multi-core cluster in 28nm UTBB FD-SOI technology

Abstract: Environmental temperature variations, as well as process variations, have a detrimental effect on performance and reliability of embedded systems implemented with deep-sub micron technologies. This sensitivity significantly increases in ultralow-power (ULP) devices that operate in near-threshold, due to the magnification of process variations and to the strong thermal inversion that affects advanced technology nodes. Supporting an extended range of reverse and forward body-bias, UTBB FD-SOI technology provides… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
5
0

Year Published

2018
2018
2023
2023

Publication Types

Select...
4
2

Relationship

3
3

Authors

Journals

citations
Cited by 7 publications
(5 citation statements)
references
References 21 publications
0
5
0
Order By: Relevance
“…Every power domain features a Process Monitoring Box (PMB) capable to probe the maximum achievable switching frequency of both P and N ring oscillators. The maximum frequency value returned by these modules, as demonstrated in [6], changes consistently with the maximum frequency of the entire power domain where they are placed, thus they can be used as on-chip frequency-meters.…”
Section: Pulpv3 Socmentioning
confidence: 81%
“…Every power domain features a Process Monitoring Box (PMB) capable to probe the maximum achievable switching frequency of both P and N ring oscillators. The maximum frequency value returned by these modules, as demonstrated in [6], changes consistently with the maximum frequency of the entire power domain where they are placed, thus they can be used as on-chip frequency-meters.…”
Section: Pulpv3 Socmentioning
confidence: 81%
“…In Fig. 13, which compares the ION/IOFF ratio obtained for both structures taking the condition where the standard-nMOS devices present the higher ratio (Ptype GP), the ULP structure shows a ratio of 2×10 10 down to 1×10 8 and 2×10 6 down to 3×10 5 for the 100 and 25 nm long devices at VSUB = -2 V and |VD| of 1 and 0.5 V respectively, while the standard-nMOS presents 3×10 8 down to 8×10 6 for the 100 nm long device and the shorter one exhibits 2×10 4 for both |VD| at the same analysis. 2 presents the threshold voltage as a function of the substrate bias for both ULP and standard diodes with and without ground planes.…”
Section: B Effect Of the Ground Plane (Gp)mentioning
confidence: 99%
“…These UTBB features are responsible for making the device suitable for low power analog [2] and RF [3] applications, and also in Ultra-Low-Power (ULP) systems [4][5][6], where low threshold voltage and low leakage current are required. One of these applications consists in RF diodes, frequently used in energy harvesting systems [7][8][9].…”
Section: Introductionmentioning
confidence: 99%
“…Despite technological scaling, which reduces the margins for supply voltage regulation, DVFS still represents a viable energy saving techniques for modern platforms operating near threshold [4]. Those platforms reach high energy efficiencies thanks to a combination of voltage scaling and adaptive body biasing to avoid performance degradation [5,6]. In [7,8], authors present two approaches where DVFS is controlled by dedicated hardware units on embedded microprocessors.…”
Section: Related Workmentioning
confidence: 99%