2016
DOI: 10.1109/tie.2015.2491880
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Temperature and Switching Rate Dependence of Crosstalk in Si-IGBT and SiC Power Modules

Abstract: . (2015) Temperature and switching rate dependence of crosstalk in Si-IGBT and SiC power modules.

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Cited by 129 publications
(84 citation statements)
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“…Hence, the turn-ON dIDS/dt can be expressed using (14). (14) When (14) is combined with (8), the resultant equation is given by (15) ( 1 ) )( (…”
Section: Ext +Rg Intmentioning
confidence: 99%
See 1 more Smart Citation
“…Hence, the turn-ON dIDS/dt can be expressed using (14). (14) When (14) is combined with (8), the resultant equation is given by (15) ( 1 ) )( (…”
Section: Ext +Rg Intmentioning
confidence: 99%
“…The fast switching rate in SiC MOSFETs coupled with parasitic inductances induces electromagnetic oscillations in the voltage and current characteristics [14]. Furthermore, oscillations in the drainsource voltage resulting from source inductance are transmitted back to the gate voltage characteristics through the Miller capacitance [15], hence, monitoring the gate transient as a TSEP is complicated. In [16], harmonic analysis of an IGBT converter output is used as a TSEP whereas in [17,18] the temperature dependency of the gate current in MOSFETs and IGBTs has been used as a TSEP for condition monitoring with promising results demonstrated.…”
Section: Introductionmentioning
confidence: 99%
“…Both the SiC 2-level converter and the Si MOSFET MMC are suited to the bidirectional operation necessary to support low carbon electrical supply using energy storage in the form of Vehicle-to-Grid (V2G) energy transfer. Furthermore, it is noted that SiC MOSFET gate drive must be bipolar in order to achieve optimum performance [7][8][9][10]15], with careful design to prevent over-or under-voltage on the gate [15] and to reduce parasitic-induced oscillations [9]. Destruction as a result of unwanted device turn-on is of far greater risk in SiC MOSFETs compared with Si MOSFETs [15,16], while gate oxide reliability has been a challenge to SiC [17,18] with some improvement in gate oxide tolerance to temperature more recently [7].…”
Section: Introductionmentioning
confidence: 99%
“…The switching behavior of WBG devices, such as Silicon Carbide (SiC) and Gallium Nitride (GaN) FETs (Field Effect Transistors), has attracted considerable research attention. There are basically three issues concerning WBG device switching behavior currently being considered in research literature [3][4][5][6][7][8][9][10][11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%