1989
DOI: 10.1109/43.39068
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Temperature dependence modeling for MOS VLSI circuit simulation

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Cited by 18 publications
(2 citation statements)
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“…Several main effects are responsible for the variation of the thermal coefficient, as the t. The Temperature influences [11][12][13] the threshold voltage, the carrier's mobility in the channel, the mobility reduction factor due to the longitudinal electrical field, the intrinsic resistors, the intrinsic diode current and capacitance. An uniform chip temperature is assumed for the power MOSFET transistor.…”
Section: The Power Mosfet Transistormentioning
confidence: 99%
“…Several main effects are responsible for the variation of the thermal coefficient, as the t. The Temperature influences [11][12][13] the threshold voltage, the carrier's mobility in the channel, the mobility reduction factor due to the longitudinal electrical field, the intrinsic resistors, the intrinsic diode current and capacitance. An uniform chip temperature is assumed for the power MOSFET transistor.…”
Section: The Power Mosfet Transistormentioning
confidence: 99%
“…[9]. Uniform heating of integrated circuit chip leads to a uniform change in tempmature sensitive parameters of all devices on the semiconductor chip.…”
Section: Introductionmentioning
confidence: 99%