Graphene
and hexagonal BC
n
N (n = 0, 1, 2), possessing a similar honeycomb crystal structure,
can easily form in-plane BC
n
N/graphene
heterojunctions, which exhibit many unique physical properties. In
this paper, we investigate the interfacial thermal conductance and
thermal rectification in three hexagonal BC
n
N/graphene heterostructures by using nonequilibrium molecular
dynamics simulations. It is found that the interfacial bonding strength
at the BC
n
N/graphene interfaces plays
a vital role in the interfacial thermal conduction. Among these three
heterostructures, BCN/graphene heterojunction exhibits the highest
interfacial thermal conductance due to its stronger interfacial bonding.
It is also found that thermal rectification occurs in the heterostructures
with the hexagonal boron nitride/graphene heterojunction having the
highest thermal rectification factor. Remarkably, the interfacial
thermal conductance of these heterojunctions can be tuned effectively
by defect engineering. The present study reveals valuable insights
into the thermal transport behavior of BC
n
N/graphene heterostructures, which will be useful for future application
of BC
n
N/graphene heterostructures in electronic
and thermal devices.