Abstract:In this work we examine the current peaks and the negative differential resistance that appear in the low electric field regime of oxide-nitride-oxide structures with a two-dimensional band of silicon nanocrystals embedded in a nitride layer. The silicon nanocrystals were synthesized by low energy ion implantation (1 keV, 1.5 x 10(16) Si(+) cm(-2)) and subsequent thermal annealing (950 degrees C, 30 min). Electrical examination was performed at temperatures from 20 to 100 degrees C using constant voltage ramp-… Show more
“…This approach enables us to determine the origin of the observed current peaks as well as to extract the trapping location of the injected carriers within the dielectric stack. These results confirm that the carriers are trapped within the Si-NC band, verifying that this region corresponds to energy minima of the dielectric stack [51].…”
Section: Si-ncs In Oxide Nitride Oxide (Ono) Stackssupporting
“…This approach enables us to determine the origin of the observed current peaks as well as to extract the trapping location of the injected carriers within the dielectric stack. These results confirm that the carriers are trapped within the Si-NC band, verifying that this region corresponds to energy minima of the dielectric stack [51].…”
Section: Si-ncs In Oxide Nitride Oxide (Ono) Stackssupporting
“…T related with the state of hydrogen since it is known that high temperat nitride deposition temperature has hydrogen concentration [2]. In our observed V FB positive shift is probab negatively charged defects like th attached hydrogen atom [8]. It is therefore evident that the specific features of the I-V characteristics i.e.…”
Section: B Structural Characterizationmentioning
confidence: 51%
“…Once the charge carriers are trapped within the NPs band they create an internal electric field that cancels the increase of the external field leading thus to the appearance of either humps or peaks in the J-E characteristics. A detailed study of the high dose implanted Si-NPs sample was performed by monitoring the current peaks in the lowfield regime by ramp I-V measurements within the temperature range of 22 to 100 o C [8]. Fig.…”
Section: B Transmission Electron Microscopymentioning
In this work we review the development of ion beam modified silicon nitride charge trap memories. Silicon low energy (typically ~1 keV) ion implantation into silicon oxide/nitride dielectric stacks may lead to two different memory structures depending on the post implantation processing steps. Annealing at 950 o C for 30 min in inert ambient of the implanted oxide/nitride stacks leads to the formation of a silicon nanoparticle band into the silicon nitride. To be functional such a structure required the subsequent deposition of a control dielectric layer. Alternatively wet oxidation at 850 o C for 15 min of the same dielectric stacks leads to the formation of a thick top silicon oxide layer. Although both structures can inject and trap electrons and holes within the nitride layer, the latter ones have an enhanced ability to retain the trapped charge, fulfilling thus the 10 years retention requirement. This property is attributed to the modification of the silicon nitride layer deep traps under the influence of the ion implantation and wet oxidation process steps. Furthermore, comparison between low-thermal budget wet oxidized silicon and inert ion (Ar, N) implanted oxide/nitride stacks shows that the formation of the top oxide depends strongly upon the implanted ions. These comparisons also indicated that nitrogen implanted oxide-nitride stacks shows a similar ability to retain the trapped charge. The above results demonstrate that low-energy ion implantation is an effective and versatile technique for the synthesis of high performance charge trapping memories.
“…A detailed study of the high-dose implanted Si-NPs sample was performed by monitoring the current peaks in the low-field regime by ramp I-V measurements within the temperature range of 22-100 C (Nikolaou 2009). Figure 3.16 shows room-temperature single sweep I-V measurements performed on the high-dose sample for ramp rates within the 0.1-0.8 V/s range.…”
Section: Determination Of the Trapping Location Of Injected Chargesmentioning
confidence: 99%
“…Considering the parallel plate capacitor, an effective thickness, t eff , can be extracted from the C eff values: (Nikolaou et al 2009) where ε ox is the permittivity of the silicon dioxide, ε o the permittivity of vacuum, and A is the area of the gate electrode. The t eff thickness is extracted around 5.8 nm for both electrons and holes.…”
Section: Determination Of the Trapping Location Of Injected Chargesmentioning
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