Temperature effect on kinetic friction characteristics of Cu substrate composed by single crystal and polycrystalline structures

Chien, Chi‐Hui; Wang, Chung-Ting; Tsai, C.E.; Yang, Ping-Feng; Lu, Ying-Xu; Chen, Bo-Syun

doi:10.1016/j.commatsci.2016.01.043

Cited by 10 publications

(2 citation statements)

References 16 publications

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“…Figure 4 c,d show the total force and the number of graphite atoms of different substrate temperatures at 100 m/s, 10 Å depth. The total force values are 2254 nN, 2188 nN, 1868 nN, and 1859 nN, correlating to 300 K, 600 K, 900 K, and 1200 K. The force slightly reduces when raising the substrate temperature because the substrate becomes softer at a higher temperature 21 – 23 . At a higher temperature, the atoms vibrate at a faster rate, the bonding strength between them is weakened, leading to a softer material.…”

Section: Resultsmentioning

confidence: 99%

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Nguyen

Fang

2021

Sci Rep

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This report explores the effects of machining depth, velocity, temperature, multi-machining, and grain size on the tribological properties of a diamond substrate. The results show that the appearance of graphite atoms can assist the machining process as it reduces the force. Moreover, the number of graphite atoms relies on the machining speed and substrate temperature improvement caused by the friction force. Besides, machining in a machined surface for multi-time is affected by its rough, amorphous, and deformed surface. Therefore, machining in the vertical direction for multi-time leads to a higher rate of deformation but a reduction in the rate of graphite atoms generation. Increasing the grain size could produce a larger graphite cluster, a higher elastic recovery rate, and a higher temperature but a lower force and pile-up height. Because the existence of the grain boundaries hinders the force transformation process, and the reduction in the grain size can soften the diamond substrate material.

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Section: Resultsmentioning

confidence: 99%

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Nguyen

Fang

2021

Sci Rep

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“…If they do, they seldom disclose how they parametrized the thermostat or justify why they chose the particular parametrization. Without any claim to completeness, we list some examples of otherwise high-quality simulations that are very likely under-thermostated − due to base thermostating or possibly overthermostated − due to full thermostating. Out of these examples, it seems that only Shiari et al are aware of some implications of their simplified thermostating efforts and concede that another group reported that material removal is greatly influenced by the thermal conditions in the shear zone…”

Section: Introductionmentioning

confidence: 99%

Thermostat Influence on the Structural Development and Material Removal during Abrasion of Nanocrystalline Ferrite

Eder

Cihak-Bayr

Bianchi

et al. 2017

ACS Appl. Mater. Interfaces

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We consider a nanomachining process of hard, abrasive particles grinding on the rough surface of a polycrystalline ferritic work piece. Using extensive largescale molecular dynamics (MD) simulations, we show that the mode of thermostatting, i.e., the way that the heat generated through deformation and friction is removed from the system, has crucial impact on tribological and materials related phenomena. By adopting an electron-phonon coupling approach to parametrize the thermostat of the system, thus including the electronic contribution to the thermal conductivity of iron, we can reproduce the experimentally measured values that yield realistic temperature gradients in the work piece. We compare these results to those obtained by assuming the two extreme cases of only phononic heat conduction and instantaneous removal of the heat generated in the machining interface. Our discussion of the differences between these three cases reveals that although the average shear stress is virtually temperature independent up to a normal pressure of approximately 1 GPa, the grain and chip morphology as well as most relevant quantities depend heavily on the mode of thermostatting beyond a normal pressure of 0.4 GPa. These pronounced differences can be explained by the thermally activated processes that guide the reaction of the Fe lattice to the external mechanical and thermal loads caused by nanomachining.

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Nanoscale friction behavior and deformation during copper chemical mechanical polishing process

Ngo,

Nguyen,

Fang

2023

J Mol Model

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Temperature effect on kinetic friction characteristics of Cu substrate composed by single crystal and polycrystalline structures

Cited by 10 publications

References 16 publications

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation

Thermostat Influence on the Structural Development and Material Removal during Abrasion of Nanocrystalline Ferrite

Nanoscale friction behavior and deformation during copper chemical mechanical polishing process

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