Gallium Phosphide (GaP) is a semiconductor with advantageous optical properties for near- and middle infrared optical systems. However, optical applications of GaP are limited by its current low machinability. To cut brittle semiconductors such as GaP and generate optical quality surfaces, it is necessary to induce a High-Pressure Phase Transformation (HPPT) so that a phase is formed that behaves ductile when machined. Along the cutting process this can be achieved by applying a negative rake angle. Otherwise, cracks will appear on the machined surface, worsening its optical capabilities. A HPPT of GaP happens at an atomic scale when a zincblende structure changes into a β-tin one. The β-tin structure behaves ductile and is metastable. Hence, the metastable β-tin phase cannot be observed during the cutting process. Therefore, atomistic simulation, such as Classic Molecular Dynamics Simulation (CMDS), is required to study the machinability under HPPT. In this work, CMDS were used to analyze GaP cutting mechanisms. A diamond tool was modelled with a cutting edge radius rβ = 10 nm, rake angle γ = -20 º, and clearance angle α = 10 º. The cut was performed with a depth of cut ap = 12 nm along the [100]-direction in a zincblende GaP workpiece. Stacking faults were found on the shear zone, {111}-planes, by two different post processes approaches. HPPT was found in the deformation zone only. A stagnation zone was found in front of the cutting edge proceeding a crack nucleation.