Temperature evolution during field activated sintering

Field Assisted Sintering Technology, Part II: Simulation

“…The contact between graphite and copper is represented by κ C,el,GC6 (p). The contact conductances depend on the applied pressure p. For the thermal contact conductance between graphite and graphite the values from the publication of [47] are used. In this work the contact conductance is separated into a vertical and horizontal part, where the values are given by κ H C,th,GG = 1.32 × 10 3 W m −2 K −1 as the horizontal, κ V C,th,GG = 2.4 × 10 3 W m −2 K −1 as the vertical thermal conductance.…”

Modeling Temperature Gradient Evolution of CoSb<SUB>3</SUB> Material for Thermoelectric Devices during Spark Plasma Sintering

“…4) In the present study, we prepared Mo/Ti/CoSb 3 samples by SPS technique, and simulated the temperature distribution of sample during sintering with finite element method, observed the microstructures in CoSb 3 region using scanning electron microscope (SEM), and measured the thermal conductivity in CoSb 3 region by laser flash method. Furthermore, we discussed how to optimize the properties of CoSb 3 -based compound from the point of view of the thermal conductivity and the electrical resistivity, respectively.…”

“…1,4) By measuring the electrical resistance of the two-layer graphite papers and the electrical resistance of the sample, respectively, and the total electrical resistance of two-layer graphite papers and sample under the same pressure as the experiments, the contact resistance between graphite paper and sample was obtained, and the contact resistance between punch and graphite paper could be know by the same way, so the resistance of two graphite papers and corresponding contact interface could be obtained and used as resistance of the horizontal graphite papers in simulation for simplification. The electrical resistivity of the horizontal graphite papers was determinded by the relationship of resistance and resistivity, and supposed the variation of electrical resistivity with temperature is same as graphite.…”

“…Therefore, the temperature field within the sample during SPS process should be understood and controlled to the best of our abilities. 4,5) Recently, there have been some works in simulating temperature distribution of sample during SPS process, including conducting and insulating materials. 1,4,6,7) However, for semi-conducting material used as thermoelectric (TE) devices, the thermoelectric property is sensitive to temperature, and mechanical property is relevant with temperature distribution in sample, thus it is necessary to study the temperature distribution and evolution of semi-conducting material during Spark Plasma Sintering.…”

Examination of Electrical Conduction of Carbonyl Iron Powder Compacts

“…13) Generally, a measurement of sintering temperature is a useful way to help discriminate the main mechanism for sintering, and allow for proper comparison with other sintering techniques. 4) However, it remains a great challenge to determine the true temperature in the particles and at the particle contacts during ECAS. In practice, a thermocouple is placed in the sintering die at a certain distance from the inner die wall to record the temperature.…”