Temperature Field Analysis of Novel Die Bonding Stage for MEMS Thermopile

Abstract

Packaging and die bonding of conventional micro‐electro‐mechanical‐systems (MEMS) and semiconductor devices include separate dispensing, mounting and heating curing. A novel die bonder's work stage and temperature control method are proposed so that dispensing, mounting and heating curing can be completed at the same station. This paper introduces the working principle of the thermopile sensor and the requirements for temperature change during die bonding, analyses the main structure and working process of the novel die bonding stage, and uses commercial finite element analysis software to evaluate the temperature field of the novel die bonding stage and devices during the process of heating, holding and cooling to provide process guidance for accurate temperature control of die bonding. Dispensing, mounting and heating curing are integrated in the same station, avoiding the position error of devices when transferring, reducing the number of equipment and floor area, and effectively saving production costs. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.