1981
DOI: 10.1116/1.570753
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Temperature measurements of glass substrates during plasma etching

Abstract: Etching of Pyrex glass substrates by inductively coupled plasma reactive ion etching for micro/nanofluidic devices J.Low temperature pulsed etching of large glass substrates

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Cited by 44 publications
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“…The phase difference δ varies even when l changes as a result of thermal expansion [2,3]. However, the coefficient of thermal expansion α for the LiNbO 3 crystal is α = 2.0 × 10 -6 K -1…”
Section: Principle Of Temperature Measurement [1]mentioning
confidence: 96%
“…The phase difference δ varies even when l changes as a result of thermal expansion [2,3]. However, the coefficient of thermal expansion α for the LiNbO 3 crystal is α = 2.0 × 10 -6 K -1…”
Section: Principle Of Temperature Measurement [1]mentioning
confidence: 96%
“…The ion power density measurements (±la-lO%) were made using the in situ substrate temperature measurement technique [i], in which the temperature of plate-glass substrates were monitored via laser interferometry [6,7].…”
Section: Methodsmentioning
confidence: 99%
“…Bond and co-workers performed temperature measurements on a glass substrate by means of the interference fringes created between light reflected from the upper and lower surfaces of the substrate during thermal expansion [6]. This method has been used to measure the temperature of PMMA substrates [7].…”
Section: Introductionmentioning
confidence: 99%