Temperature stability of the frequency of a resonant micro scanning mirror

Wolter, Alexander; Korth, H.; Schenk, Harald; Lakner, Hubert

doi:10.1109/omems.2003.1233464

Cited by 3 publications

(2 citation statements)

References 3 publications

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“…In previous studies, Wolter et al [4] investigated the effect of stress behavior induced by ambient temperature difference on the resonant frequency of micro scanning mirror. Miyajima [5] studied the reliability issue about the instability of scanning angle due to the thermal effect and developed a MEMS electromagnetic optical scanner for a commercial laser scanning microscope.…”

Section: Introductionmentioning

confidence: 99%

The Effect of Thermal Prestress on the Deformation of Micromirror Chip Embedded with Through-Silicon Vias

Yeh

2011

KEM

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The thermal expansion mismatch problem for a chip due to temperature decrease from processing temperature to room temperature may cause residual stress inside the chip structure. The thermal prestress accumulated and may affect the chip reliability when the chip was subjected to the thermal loading again. In this paper, the effect of thermal prestress on the micromirror chip embedded with copper through-silicon vias (TSVs) was investigated by the finite element method. In analysis, the micromirror chip embedded with TSVs was analyzed first under thermal loading which resulted from temperature decrease between the stress free processing temperature and room temperature. This process produced a thermal prestress in the micromirror chip. The chip was then subjected to a heat source at the bottom while in operation and the heat transfer analysis was used to simulate this situation. Finally, the thermal stress analysis was carried out to obtain the deformation and the stress distribution in the chip. The results show that the thermal prestress had strong effect on the chip reliability and should be reduced as much as possible. This paper proposed a three steps analysis method to obtain the deformation and the stress distribution in the chip, in which the effect of thermal prestress on the chip reliability was evaluated effectively.

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Section: Introductionmentioning

confidence: 99%

The Effect of Thermal Prestress on the Deformation of Micromirror Chip Embedded with Through-Silicon Vias

Yeh

2011

KEM

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“…As in the case of packaging other MOEMS, for instance resonant micro scanning mirrors [4], it is very important to avoid thermomechanical stress due to the bonding process and changes of the operating conditions. Hence, with respect to the optimisation of the GF, the activities target mainly on the selection of well-suited adhesives and on the development of corresponding technological application and curing processes.…”

Section: Introductionmentioning

confidence: 99%

High Surface Planarity Die Bonding of Large Optical Chips

Künzelmann

Wagner²,

Schenk³

et al. 2005

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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Analog Spatial Light Modulators (ASLM) are highly specialised MOEMS devices, which, in our case, are used as programmable mask in extremely high-resolution DUV mask writing systems. Resolution, precision, contrast and optical uniformity of the mask patterns produced by this new type of mask writers depend on the local and global planarity as well as on the optical contrast of the ASLM devices [1].

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Applications and requirements for MEMS scanner mirrors

et al. 2005

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Micro scanning mirrors are quite versatile MEMS devices for the deflection of a laser beam or a shaped beam from another light source. The most exciting application is certainly in laser-scanned displays. Laser television, home cinema and data projectors will display the most brilliant colors exceeding even plasma, OLED and CRT. Devices for front and rear projection will have advantages in size, weight and price. These advantages will be even more important in neareye virtual displays like head-mounted displays or viewfinders in digital cameras and potentially in UMTS handsets. Optical pattern generation by scanning a modulated beam over an area can be used also in a number of other applications: laser printers, direct writing of photo resist for printed circuit boards or laser marking and with higher laser power laser ablation or material processing. Scanning a continuous laser beam over a printed pattern and analyzing the scattered reflection is the principle of barcode reading in 1D and 2D. This principle works also for identification of signatures, coins, bank notes, vehicles and other objects. With a focused white-light or RGB beam even full color imaging with high resolution is possible from an amazingly small device. The form factor is also very interesting for the application in endoscopes. Further applications are light curtains for intrusion control and the generation of arbitrary line patterns for triangulation. Scanning a measurement beam extends point measurements to 1D or 2D scans. Automotive LIDAR (laser RADAR) or scanning confocal microscopy are just two examples. Last but not least there is the field of beam steering. E.g. for alloptical fiber switches or positioning of read-/write heads in optical storage devices. The variety of possible applications also brings a variety of specifications. This publication discusses various applications and their requirements

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Temperature stability of the frequency of a resonant micro scanning mirror

Cited by 3 publications

References 3 publications

The Effect of Thermal Prestress on the Deformation of Micromirror Chip Embedded with Through-Silicon Vias

The Effect of Thermal Prestress on the Deformation of Micromirror Chip Embedded with Through-Silicon Vias

High Surface Planarity Die Bonding of Large Optical Chips

Applications and requirements for MEMS scanner mirrors

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