Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

Shohji, Ikuo; Yoshida, Tomohiro; Takahashi, Takehiko; Hioki, Susumu

doi:10.1016/j.msea.2003.09.057

Cited by 191 publications

(76 citation statements)

References 8 publications

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“…This formulation could be further modified and improved if more materials are investigated. However, the solder materials are not included in this simplified form because solder materials present quite different material properties from carbon-based materials, where they has more significant deformation at break and higher full fatigue capacity [29,30]. Therefore, the solder materials should be separately discussed to develop a simplified formulation.…”

Section: The Economymentioning

confidence: 99%

A Unified Creep-Fatigue Equation with Application to Engineering Design

Liú¹,

Pons²

2018

Creep

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Background: Creep-fatigue damage occurs under cyclic loading at elevated temperature. The existing creep-fatigue models have limited ability to cover the full combination of creep and fatigue behaviours, except with extensive prior empirical testing. Consequently, they cannot effectively and efficiently be used for early engineering design.Approach: We present a strain-based unified creep-fatigue formulation that overcomes these limitations. We validate this equation against empirical data for multiple materials, and shows it is able to cover full ranges from pure fatigue to pure creep. A simplified formulation is developed where the coefficients are extracted through simple creep-rupture tests. We show how the equation may be used in a design situation, by application to a representative gas turbine blisk. Included here is a demonstration of how the equation may be integrated into finite element analysis, which is an important practical consideration in the design work flow.Outcomes: The results demonstrate that the unified equation evidences fidelity to empirical data for creep-fatigue behaviours for multiple metallic materials. The usefulness of this equation is the ability to identify candidate materials for creep-fatigue loading situations. The ability to achieve this at relatively early design stages is advantageous because of the economy and convenience provided.

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Section: The Economymentioning

confidence: 99%

A Unified Creep-Fatigue Equation with Application to Engineering Design

Liú¹,

Pons²

2018

Creep

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“…For lead-containing solders, which have been extensively studied and applied (e.g. 63%Sn-37%Pb), various annealing treatments existed with a wide range of temperature (40-150°C) and duration (1-10 h) [6][7][8][9]. Apparently, the annealing temperatures and durations in the literature vary significantly for both lead-free and lead-containing solder materials.…”

Section: Introductionmentioning

confidence: 99%

Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Long

Wang

Feng

et al. 2017

Materials Science and Engineering: A

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In this study, residual stress in Sn-3.0Ag-0.5Cu lead-free solder after annealing at varying temperature and duration was investigated by nanoindentation and uniaxial tensile experiments. Based on the unloading response of load-penetration depth, the contact stiffness was theoretically calculated and found to be decreased with increasing annealing duration especially at the annealing temperature of 210°C. Additionally, the effect of residual stress on constitutive behaviour at strain rates of 1×10 −3 s −1 , 5×10 −4 s −1 and 1×10 −4 s −1 was consistently observed. By correlating residual stress and elastic indentation recovery, it was confirmed that greater contact stiffness is induced by greater compressive residual stress. Therefore, the optimal annealing condition of SAC305 solder is 210°C for 12 h, which is believed to minimize the residual stress and stabilize the mechanical property of annealed solder.

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“…[2][3][4] However, it was pointed out that the microstructure of the conventional bulk specimen does not correspond with that of the real solder joint, since the real solder joint is miniaturized and it is difficult to duplicate the solidification conditions of the real joint in the bulk specimen. 5,6) Kariya and co-workers developed a new testing method for solder alloys and joints using micro size specimens having analogous size and microstructures to those of real solder joints.…”

Section: Introductionmentioning

confidence: 99%

Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

et al. 2008

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Tensile properties of several Sn-Ag-Cu lead-free solders have been investigated by micro size specimens. For as-cast specimens, tensile strength increases with increasing content of Cu and Ag. After aging at 120 C for 168 h, however, tensile strengths are similar among eutectic and hypereutectic alloys. The similar tendency was observed among hypoeutectic alloys. Moreover, negligible change was found in tensile strength between specimens aged at 120 C for 168 h and 504 h in all solders. The strength change with aging corresponds to microstructural change of the solder. In the cases of eutectic and hypoeutectic alloys, as-cast microstructures are composed of coarsened primary Sn phases and finer eutectic phases of Sn and intermetallic compounds. The primary Sn phases and the eutectic phases are homogenized upon aging. In contrast, finer Sn and eutectic phases are formed in as-cast hypereutectic alloys. The finer phases are coarsened upon aging. After aging, homogenization of the Sn phases and the eutectic phases occurred in all solders.

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Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

Cited by 191 publications

References 8 publications

A Unified Creep-Fatigue Equation with Application to Engineering Design

A Unified Creep-Fatigue Equation with Application to Engineering Design

Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

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