Tensile tests of micro-specimens composed of electroplated gold

Yanagida, Sari; Chang, Tso-Fu Mark; Chen, Chun-Yi; Nagoshi, Takashi; Yamane, Daisuke; Machida, Katsuyuki; Masu, Kazuya; Sone, Masato

doi:10.1016/j.mee.2016.12.004

Cited by 11 publications

(2 citation statements)

References 17 publications

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“…[12][13][14][15][16] These variations can be attributed to the micro texture of electroplated films which varies widely from conventional polycrystalline texture to fine columnar texture depending on the electroplating condition. [17][18][19] Therefore, it is necessary to establish a method for controlling the micro texture in order to develop highly functional and highly reliable electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging

Nakoshi

Suzuki

Miura

2019

Jpn. J. Appl. Phys.

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In this study, the effect of crystallinity, in other words, the order of atom arrangement of grains and grain boundaries in electroplated gold thin films on their mechanical properties was investigated by using electron back-scatter diffraction analysis, X-ray diffraction, and a nano-indentation test. The crystallinity of the electroplated gold thin film varied by changing the under layer materials: Cr/Pt/Au and Ti/Au, and annealing at 400 °C after electroplating. The variation of the microtexture caused the wide variation of mechanical properties of the electroplated gold films; Young’s modulus fluctuated significantly from 79 to 113 GPa mainly depending on the crystallinity, and hardness also fluctuated from 0.90 to 2.75 GPa depending on the grain size. Therefore, it was confirmed that the control of the order of atom arrangement of electroplated gold films is indispensable for controlling the variation of mechanical properties and improving the reliability of electroplated gold bumps as a result.

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Section: Introductionmentioning

confidence: 99%

Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging

Nakoshi

Suzuki

Miura

2019

Jpn. J. Appl. Phys.

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“…The grain boundary strengthening mechanism, also known as the Hall-Petch relationship, is a broadly applied strengthening mechanism for metallic materials. [7][8][9][10] The yield stress shows an inverse squareroot relationship with its average grain size, that is, strengthening is achieved along with grain refinement of the metallic material. High yield stress of 800 MPa is attained from micro-bending test of a microcantilever fabricated from electrodeposited pure gold.…”

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confidence: 99%

High Strength Electrodeposited Au-Cu Alloys Evaluated by Bending Test toward Movable Micro-Components

Asano

Chang

Tang

et al. 2019

ECS J. Solid State Sci. Technol.

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Au-Cu alloy micro-cantilevers are fabricated from Au-Cu alloy films electrodeposited at different current density. Bending deformation behaviors of the Au-Cu alloy micro-cantilevers are evaluated for applications as components in MEMS devices. Au-Cu alloy films with smaller grain size and higher copper content are obtained when a higher current density is used. The Au-Cu alloy film electrodeposited at 5 mA/cm 2 has the finest average grain size among films prepared in this work, which the grain size is 4.76 nm. Bending test of a micro-cantilever prepared from this film shows a high yield stress at 1826 MPa. The high strength is contributed by synergetic effects of the grain boundary strengthening and the solid solution strengthening mechanisms. The deformation behavior changes from ductile to brittle as the copper content increased. The capability to control the grain size and copper concentration simply by adjusting the current density and the high strength are both advantageous in fabrication of MEMS components.

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