Proceedings of the Fifth IEEE International Caracas Conference on Devices, Circuits and Systems, 2004.
DOI: 10.1109/iccdcs.2004.1393357
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Test chip and infrastructure IP solutions to improve the back-end process during all phases from a new technology development to manufacturing

Abstract: This paper presents a test chip and infrastructure IP (I-IP) solutions to accelerate process development of interconnect on new advanced technology and to improve the back-end-of-line (BEOL) yield on products. The test chip and the I-IP use the same architecture which is described in using a bottom-up approach with emphasis on its scalability. Using this test chip, the specifications of process back-end critical parameters can be quickly and easily analyzed. Using the dedicated infrastructure IP, the defect de… Show more

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