2011 Design, Automation &Amp; Test in Europe 2011
DOI: 10.1109/date.2011.5763065
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Test time reduction in analogue/mixed-signal devices by defect oriented testing: An industrial example

Abstract: We present an application of Defect Oriented Testing (DOT 1 ) to an industrial mixed signal device to reduce test time and maintain quality. The device is an automotive IC product with stringent quality requirements and a mature test program that is already in volume production. A complete flow is presented including defect extraction, defect simulation, test selection, and validation. A major challenge of DOT for mixed signal devices is the simulation time. We address this challenge with a new fault simulatio… Show more

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Cited by 21 publications
(13 citation statements)
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“…In this section, we present the algorithm for deriving the set C 1 in (2) that defines the parametric fault model F in (3) and the set C 2 ( ) in (5) that defines the set of marginally functional circuits instances Y( ) in (6). The algorithm targets specifically the derivation of C 1 and as a by-product it also derives C 2 ( ).…”
Section: Algorithmmentioning
confidence: 99%
See 1 more Smart Citation
“…In this section, we present the algorithm for deriving the set C 1 in (2) that defines the parametric fault model F in (3) and the set C 2 ( ) in (5) that defines the set of marginally functional circuits instances Y( ) in (6). The algorithm targets specifically the derivation of C 1 and as a by-product it also derives C 2 ( ).…”
Section: Algorithmmentioning
confidence: 99%
“…This approach has led to defect-oriented test techniques [6]- [8] which can be applied for wafer-level testing to detect dies with gross defects or for final testing of robust designs that are highly unlikely to fail due to process variations.…”
Section: Introductionmentioning
confidence: 99%
“…This approach has led to defect-oriented test techniques [2], [3] which can be applied for wafer-level testing to detect dies with gross defects or for final testing of robust designs that are highly unlikely to fail due to process variations.…”
Section: Introductionmentioning
confidence: 99%
“…An Inductive Fault Analysis (IFA) like approach utilizes the layout details of a design [16]. This methodology is adopted in [17] to extract the shorts/bridges for an industrial mixed signal chip, where the layout details are passed to a parasitic capacitor extractor and the capacitance values are used to calculate the probability of short between two nets. These nets can be either, two metal tracks, two polysilicon layers or a metal and a polysilicon layer.…”
Section: Introductionmentioning
confidence: 99%