2013 22nd Asian Test Symposium 2013
DOI: 10.1109/ats.2013.13
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Testable Design for Electrical Testing of Open Defects at Interconnects in 3D ICs

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Cited by 4 publications
(2 citation statements)
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“…Another is the electronic signals of the circuit, such as the signals of voltage and current [II,12]. The characteristics of the fault behaviors that are monitored by test points are called the set of tests, the mathematical expression is FC 3 U;).…”
Section: A Fault Behavior Setmentioning
confidence: 99%
“…Another is the electronic signals of the circuit, such as the signals of voltage and current [II,12]. The characteristics of the fault behaviors that are monitored by test points are called the set of tests, the mathematical expression is FC 3 U;).…”
Section: A Fault Behavior Setmentioning
confidence: 99%
“…Their method can detect open and short defects and identify the faulty interconnects by applying proper test patterns and can repair faulty interconnects caused by open defects. Hashizume et al proposedthe electrical test method and a DFT method in[68]. They also examined feasibility of their electrical tests by Spice simulation and some experiments for a PCB circuit made of our prototyping IC that had been designed by the DFT method.…”
mentioning
confidence: 99%