Texture and microstructure of rolled and annealed tantalum

Raabe, Dierk; Schlenkert, G.; Weisshaupt, H.; Lücke, K.

doi:10.1179/026708394790163942

Cited by 23 publications

(19 citation statements)

References 3 publications

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“…10,11 Fabrication of Ta plate by rolling typically results in inhomogeneous crystallographic textures and grain sizes with strong through-thickness gradients. 12 Depending upon the through-thickness position in the plate at which the microstructure is evaluated, one might find a predominantly (100) or (111) texture component (among other variants), resulting in significantly differing sputtering performance as a function of through-thickness position. A sputtering target made from such a structure would have widely varying sputtering rates both spatially and temporally.…”

Section: Introductionmentioning

confidence: 99%

Microstructural development in asymmetric processing of tantalum plate

Field

Yanke

Mcgowan

et al. 2005

Journal of Elec Materi

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Sputtered tantalum (Ta) and TaN are employed as barrier layers in modern integrated circuits to enable reliable use of Cu as an interconnect material. The directional properties of sputtering Ta can result in nonuniform film thicknesses (from heavily textured plate) and unpredictable sputtering rates (from plates with through thickness texture gradients). This results in film thicknesses larger than necessary because of the sputtering being unpredictable. This presentation reports on an effort to increase textural and grain size uniformity in Ta by deforming the plate under conditions that simulate asymmetric rolling. This is accomplished by using a channel die configuration with uneven friction on the top and bottom plates so that a strong shear component is added to the plane strain condition enforced by the channel dies. Results indicate a trend towards less severe texture banding and more uniform structure in the plate processed by asymmetric friction conditions.

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Section: Introductionmentioning

confidence: 99%

Microstructural development in asymmetric processing of tantalum plate

Field

Yanke

Mcgowan

et al. 2005

Journal of Elec Materi

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“…Mathaudhu et al 20 report about the evolution of the density of HABs in tantalum deformed by 4 ECAP passes (route B c ). This material is similar to niobium in certain properties 30 . It was observed that the tantalum billet exhibited partial recrystallization, and this phenomenon occurred initially in the regions containing deformation inhomogeneities (banded areas).…”

Section: Annealing Behaviormentioning

confidence: 95%

Microstructural Stability of a Niobium Single Crystal Deformed by Equal Channel Angular Pressing

et al. 2017

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A [211]-oriented niobium single crystal was deformed by equal channel angular pressing (ECAP) at room temperature using the route B c to a total strain of 9.2. A sharp cube texture develops after ECAP processing. The deformed samples were annealed in vacuum from 400ºC (673 K) to 900ºC (1173 K) for 1 h to evaluate their microstructural stability. Scanning electron microscopy (SEM) was used to image the microstructures of as-deformed and annealed specimens. Electron backscatter diffraction (EBSD) was employed to determine the respective microtextures before and after annealing. Coarsening of the microstructure occurs at a maximum rate at 550ºC (823 K) due to discontinuous recrystallization. Normal grain growth replaces discontinuous recrystallization as the main coarsening mechanism above 700ºC (973 K).

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“…5(c) and 6(c)) as also observed in other bcc metals. 18,19) In uniaxially compressed Mo ingot, both {001} and {111} formed along the compression axis as well. 8) By increasing the strain, the uniaxially compressed Mo demonstrated an increase in {001} 8) rather than {111}.…”

Section: Microstructure and Texturementioning

confidence: 99%

Effects of Molybdenum Microstructures on Sputtered Films

2015

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The textures of 99.9% purity molybdenum plates in both rolled and recrystallized conditions were investigated by electron backscattering diffraction. The as-rolled molybdenum plates showed a change in texture from {001}©110ª toward {111}©110ª with increasing reduction ratio indicating that the texture can be modified through rolling schedule. Both the as-rolled and recrystallized molybdenum plates were made to sputter thin films and to examine the effects of sputtering target microstructures upon sputtered films. The as-rolled sputtering target demonstrated 11% higher sputtering rate than the recrystallized molybdenum target under the same sputtering conditions. Microstructures in the as-rolled plates bear a higher tendency to sputter due to their higher energy. The structures of the sputtering targets demonstrate pronounced effects upon the sputtered films.

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Texture and microstructure of rolled and annealed tantalum

Cited by 23 publications

References 3 publications

Microstructural development in asymmetric processing of tantalum plate

Microstructural development in asymmetric processing of tantalum plate

Microstructural Stability of a Niobium Single Crystal Deformed by Equal Channel Angular Pressing

Effects of Molybdenum Microstructures on Sputtered Films

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