2017
DOI: 10.1088/0256-307x/34/10/104202
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The 8×10 GHz Receiver Optical Subassembly Based on Silica Hybrid Integration Technology for Data Center Interconnection

Abstract: An 8×10 GHz receiver optical sub-assembly (ROSA) consisting of an 8-channel arrayed waveguide grating (AWG) and an 8-channel PIN photodetector (PD) array is designed and fabricated based on silica hybrid integration technology. Multimode output waveguides in the silica AWG with 2% refractive index difference are used to obtain flat-top spectra. The output waveguide facet is polished to 45° bevel to change the light propagation direction into the mesa-type PIN PD, which simplifies the packaging process. The exp… Show more

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Cited by 4 publications
(1 citation statement)
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“…As the centerpiece of wavelength division multiplexing (WDM), AWG has been fabricated by silicon-on-insulator [5], SiO 2 [6,7], and polymers [8][9][10][11]. Though AWG has been highly developed by the standard industry technology of planar lightwave circuits (PLCs), and the cost is being gradually reduced by the mature fabrication process of silica-based waveguide [12][13][14], the polymer AWG has its own advantages and can avoid complex preparation processes such as thermal oxidation, plasma-enhanced chemical vapor deposition (PECVD), and inductively coupled plasma (ICP) etching [12][13][14]. Compared with silica-based devices, polymer-based devices can skip several steps in manufacture, resulting in reduced prices for the setup and, especially for small batch sizes, a reduced price per unit [15][16][17].…”
Section: Introductionmentioning
confidence: 99%
“…As the centerpiece of wavelength division multiplexing (WDM), AWG has been fabricated by silicon-on-insulator [5], SiO 2 [6,7], and polymers [8][9][10][11]. Though AWG has been highly developed by the standard industry technology of planar lightwave circuits (PLCs), and the cost is being gradually reduced by the mature fabrication process of silica-based waveguide [12][13][14], the polymer AWG has its own advantages and can avoid complex preparation processes such as thermal oxidation, plasma-enhanced chemical vapor deposition (PECVD), and inductively coupled plasma (ICP) etching [12][13][14]. Compared with silica-based devices, polymer-based devices can skip several steps in manufacture, resulting in reduced prices for the setup and, especially for small batch sizes, a reduced price per unit [15][16][17].…”
Section: Introductionmentioning
confidence: 99%