1982
DOI: 10.1109/tchmt.1982.1135972
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The Aging Behavior of Commercial Thick-Film Resistors

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1983
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Cited by 19 publications
(3 citation statements)
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“…As components age, they will experience performance degradation and eventual failure. For example, electromigration, a process that causes circuit failure by increasing the resistivity of a wire [25], is accelerated by high temperatures [26], [27]. The time to failure [25] is a common measure of reliability.…”
Section: B Aging and The Ecology Of Rctamsmentioning
confidence: 99%
“…As components age, they will experience performance degradation and eventual failure. For example, electromigration, a process that causes circuit failure by increasing the resistivity of a wire [25], is accelerated by high temperatures [26], [27]. The time to failure [25] is a common measure of reliability.…”
Section: B Aging and The Ecology Of Rctamsmentioning
confidence: 99%
“…rich or poor of oxygen, humidity (Coleman, 1979;Sinnadurai and Wilson, 1982). Out-diffusion and in-diffusion of oxygen have been postulated to interpret the effect of the atmosphere and the reduced shift of encapsulated (glazed) resistors compared to unprotected ones.…”
Section: 4mentioning
confidence: 99%
“…One of the methods for predicting the possible failures that can occur in usage is accelerated ageing. Detailed studies of the ageing mechanism of thick film hybrid integrated circuits (ICs) have been carried out by various authors 1234567…”
Section: Introductionmentioning
confidence: 99%