The Anand parameters for SAC solders after extreme aging

Basit, Munshi; Ahmed, Sudan; Motalab, Mohammad; Roberts, Jordan C.; Suhling, Jeffrey C.; Lall, Pradeep

doi:10.1109/itherm.2016.7517582

Cited by 43 publications

(6 citation statements)

References 28 publications

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“…However, reduced Poisson’s ratios, in other words, the relative ratio between the lateral strains to the axial strains is reduced. Similar works were performed by Basit et al (Basit et al , 2015; Basit et al , 2016; Basit et al , 2014; Ahmed et al , 2015) reporting that the silver existence positively impacts the yield and tensile strengths of the SAC composition for various solidification conditions and at different loading temperatures. Mustafa et al ’s (2011) investigations of the thermal reliability of SAC solders under strain-controlled testing conditions showed that the interconnects with lesser Ag amounts resulted in further degradation.…”

Section: Introductionsupporting

confidence: 78%

“…For the effect of the addition of Ag in SAC solders, it is expected that solders with high Ag% to become more brittle and thus have higher ultimate tensile strength (Chen et al , 2023), whereas low Ag% solders’ behavior is more ductile, and they have lower hardness (Rodgers et al , 2002). The mechanical properties of SAC × 05 interconnects are thoroughly investigated by Munshi et al (Basit et al , 2015; Basit et al , 2016; Basit, 2015) using extensive tensile test experiments. In such investigations, the tensile tests were conducted at various strain rates, including 10 −3 , 10 −4 and 10 −5 per second, and at different loading temperatures (25°C, 50°C, 75°C, 100°C and 125°C).…”

Section: Solder Alloys With Different Ag Contentsmentioning

confidence: 99%

“…Elastic modulus and ultimate tensile strength values of SAC Â 05 considering at different loading temperatures(Basit et al, 2015;Basit et al, 2016) …”

mentioning

confidence: 99%

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Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Gharaibeh,

Al-Oqla

2023

SSMT

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Purpose There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents. Design/methodology/approach A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models. Findings The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility. Originality/value Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.

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Section: Introductionsupporting

confidence: 78%

Section: Solder Alloys With Different Ag Contentsmentioning

confidence: 99%

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Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Gharaibeh,

Al-Oqla

2023

SSMT

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“…3.5.7 Anand Viscoplasticity Constitutive Equation for Sn1Ag0.5Cu, Sn2Ag0.5Cu, Sn3Ag0.5Cu, and Sn4Ag0.5Cu Solders After Extreme Aging. For SAC105, SAC205, SAC305, and SAC405 solders, the nine parameters of the Anand viscoplasticity constitutive equations have been determined by Basit et al [96] for four different cooling profiles. These included water quenched (WQ), reflowed (RF), RF þ 6 months of aging at 100 C, and RF þ 12 months of aging at 100 C. For each condition, a set of stress-strain tests performed at three different strain rates (10 À3 , 10 À4 , and 10 À5 1/s) and five different temperatures (25, 50, 75, 100, and 125 C).…”

Section: Anand Viscoplasticity Constitutive Equation Formentioning

confidence: 99%

“…For WQ cooling, all the solders considered in Ref. [96], the Anand parameters (s 0 , h 0 , andŝÞ are at the "upper bound" of what is possible as far as stiffness and strength. For long (extreme) aging such as RF þ 12 months, the Anand parameters (s 0 , h 0 , andŝÞ are at the "lower bound" of what is possible for all the solders.…”

Section: Anand Viscoplasticity Constitutive Equation Formentioning

confidence: 99%

State of the Art of Lead-Free Solder Joint Reliability

Lau

2020

Journal of Electronic Packaging

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State-of-the-art of lead-free solder-joint reliability is investigated in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis. For DFR: (a) the Norton power creep constitutive equations and examples for Au20Sn, Sn58Bi, Sn3.8Ag0.7Cu, and Sn3.8Ag0.7Cu0.03Ce, (b) the Wises two power creep constitutive equations and examples for Sn3.5Ag and Sn4Ag0.5Cu, (c) the Garofalo hyperbolic sine creep constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.9Ag0.6Cu, Sn3.8Ag0.7Cu, Sn3.5Ag0.5Cu, and Sn3.5Ag0.75Cu, Sn4Ag0.5Cu, Sn(3.5-3.9)Ag(0.5-0.8)Cu, 100In, Sn52In, Sn3.8Ag0.7Cu0.03Ce, and Au20Sn, and (d) the Anand viscoplasticity constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.8Ag0.7Cu, Sn3.8Ag0.7CuCe, Sn3.8Ag0.7CuAl, Au20Sn, Sn3.5Ag with temperature and strain rate dependent parameters, and Sn1Ag0.5Cu, Sn2Ag0.5Cu, Sn3Ag0.5Cu, and Sn4Ag0.5Cu after extreme aging will be discussed. For reliability testing and data analysis: (a) the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests, (b) the true Weibull slope, true characteristic life, and true mean life, and (c) the linear acceleration factors for various lead-free solder alloys based on: (i) frequency and maximum temperature, (ii) dwell time and maximum temperature, and (iii) frequency and mean temperature will be presented. Some recommendations will also be provided.

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Design for Reliability of Solder Joints

Lau

Lee

2020

Assembly and Reliability of Lead-Free Solder Joints

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The Anand parameters for SAC solders after extreme aging

Cited by 43 publications

References 28 publications

Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents

State of the Art of Lead-Free Solder Joint Reliability

Design for Reliability of Solder Joints

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