The application of laser process technology to thin film packaging

Redmond, Thomas F.; Lankard, J. R.; Balz, J.G.; Proto, G. R.; Wassick, Thomas

doi:10.1109/ectc.1992.204338

Cited by 11 publications

(3 citation statements)

References 18 publications

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“…An RF induced plasma is used to increase the etch rate of the debris. Defects due to residue are dramatically lower in this process compared to the RIE process [23].…”

Section: Laser Ablationmentioning

confidence: 99%

“…The process has very few critical parameters which can be very well controlled: 1) laser fluence, 2) number of pulses, and 3) focus. The wall profiles are very uniform and can be controlled from 30" to 65" by changing the focus conditions [23]. The process is not aspect ratio limited for packaging applications and almost any polymer dielectric can be used.…”

Section: Laser Ablationmentioning

confidence: 99%

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Multilevel thin film packaging: applications and processes for high performance systems

Prasad

Perfecto

1994

IEEE Trans. Comp., Packag., Manufact. Technol. B

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IBM has developed and implemented multilayer thin films (MLTF) for both high end and cost-performance systems since the early 1980's. Copper-polymer and Aluminum-polymer multilayer thin films have been implemented on silicon, alumina, and glass-ceramic substrates. The various MLTF implementations are: 0 Two layers of Cu-polyimide interconnection on dry pressed alumina for single and dual chip applications, using wet etch of polyimide and subtractive etching of Cr-Cu-Cr for wiring. 0 One to two layers of planar Cu-polyimide interconnection on alumina and glass-ceramic multichip modules for redistribution of chip YO'S to the ceramic vias, using laser ablation for via definition, subtractive etching of Cr-Cu-Cr for wiring definition, and liftoff for bonding pad definition. 0 Four layers of Al-polyimide multichip interconnection on silicon substrates, using reactive ion etching for via definition, subtractive etching of aluminum for wiring definition, and evaporation through a mask for bonding pad definition. 0 Four to five layers of planar Cu-polyimide interconnection on glass-ceramic substrates, using laser ablation for via definition, photosensitive polyimide (PSPI) lithography and blanket electroplating for wiring definition, and liftoff for bonding pad definition. 0 Four or five layers of non-planar Cu-polyimide interconnection on alumina, silicon, and glass-ceramic substrates, using laser ablation or photosensitive polyimide lithography for via definition, additive electroplating or subtractive etching of Cu for wiring definition, and additive electroplating for bonding pad definition.In this paper we discuss the evolution of these thin film technologies as well as the process choices, their merits, and the reasoning behind the various choices.

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“…An RF induced plasma is used to increase the etch rate of the debris. Defects due to residue are dramatically lower in this process compared to the RIE process [23].…”

Section: Laser Ablationmentioning

confidence: 99%

Section: Laser Ablationmentioning

confidence: 99%

Multilevel thin film packaging: applications and processes for high performance systems

Prasad

Perfecto

1994

IEEE Trans. Comp., Packag., Manufact. Technol. B

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“…Among these technologies is Laser Chemical Vapor Deposition (LCVD) that is used to make discrete thin film interconnections on thin films lines [9]. To test the reliability of the deposited metal on thin film lines a number of repairs were subjected to various stress conditions such as electromigration, thermal cycling, and vibration.…”

Section: Latent Opens Testingmentioning

confidence: 99%

Electrical test of multichip substrates

Economikos

Morrison

Crnic³

1994

IEEE Trans. Comp., Packag., Manufact. Technol. B

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For complex substrates, electrical test is a fundamental element of cost control and quality assurance. Test technologies for multi-chip substrate applications must handle densely wired products with small, tightly spaced contact features. Detection of latent defects or near defects is crucial in meeting reliability objectives. Cluster probe resistance, capacitance, and electron beam approaches have all been applied to substrate electrical test. IBM's latent opens test is used to screen opens and near opens in thick and thin films and to characterize the interface of bonded metals in interconnection technologies. Key substrate test technology elements include: buckling beam top surface and spring probe bottom surface contact schemes, optical mapping and alignment techniques, automated product and data logistics, and the "full cluster" tester which contacts over 23,000 test points at a single time. Index Terms-Electrical module test, multichip test, latent defects, near opens, thin films test, thick films test, full cluster test, electron beam, buckling beam probe.

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Cumulative Heat Effect in Excimer Laser Ablation of Polymer PC and ABS

Wei

Yang

2003

The International Journal of Advanced Manufacturing Technology

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Analysis of the thermal effect and machining properties of PC (polycarbonate) and ABS (polyacrylonitrilebutadienestyrene) polymers when ablated using a KrF excimer laser is described. PC has less thermal effect on the geometric distortion than ABS in laser ablation. The cumulative heat during laser ablation results in geometric deformation in ABS micromachining. The number of laser pulses generates a greater geometric deformation in ABS than in PC according to experimental laser ablation observations. The PC ablation rate is proportional to the laser fluence, whereas ABS shows an exponential profile. The pulse repetition rate has no significant influence on PC during laser ablation, but affects the ablated patterns in ABS. During laser ablation, PC does not produce debris on the machining patterns, but debris is produced on the machining patterns with ABS.

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The application of laser process technology to thin film packaging

Cited by 11 publications

References 18 publications

Multilevel thin film packaging: applications and processes for high performance systems

Multilevel thin film packaging: applications and processes for high performance systems

Electrical test of multichip substrates

Cumulative Heat Effect in Excimer Laser Ablation of Polymer PC and ABS

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