The application of laser process technology to thin film packaging

Redmond, Thomas F.; Lankard, J. R.; Balz, J.G.; Proto, G. R.; Wassick, Thomas

doi:10.1109/33.214854

Cited by 9 publications

(2 citation statements)

References 18 publications

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“…The thermal effect is localized and controlled by the pulse duration. The removal rate is a function of the fluence [5]. The 248 and 308 nm wavelength ablation of PTFE doped with PI showed that the proper sensitizer choice would enable etching most transparent materials at almost any wavelength [6].…”

Section: Introductionmentioning

confidence: 99%

Cumulative Heat Effect in Excimer Laser Ablation of Polymer PC and ABS

Wei

Yang

2003

The International Journal of Advanced Manufacturing Technology

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Analysis of the thermal effect and machining properties of PC (polycarbonate) and ABS (polyacrylonitrilebutadienestyrene) polymers when ablated using a KrF excimer laser is described. PC has less thermal effect on the geometric distortion than ABS in laser ablation. The cumulative heat during laser ablation results in geometric deformation in ABS micromachining. The number of laser pulses generates a greater geometric deformation in ABS than in PC according to experimental laser ablation observations. The PC ablation rate is proportional to the laser fluence, whereas ABS shows an exponential profile. The pulse repetition rate has no significant influence on PC during laser ablation, but affects the ablated patterns in ABS. During laser ablation, PC does not produce debris on the machining patterns, but debris is produced on the machining patterns with ABS.

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Section: Introductionmentioning

confidence: 99%

Cumulative Heat Effect in Excimer Laser Ablation of Polymer PC and ABS

Wei

Yang

2003

The International Journal of Advanced Manufacturing Technology

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“…The degradation and evaporation of polymers during excimer laser ablation have been studied in detail and are a combination of photochemical bond breaking and photothermal polymer degradation. [3][4][5][6][7] Most polymers, however, are not able to be ablated by the more efficient and less expensive visible light lasers. Enhancing micromachining effectiveness by doping polymer films with dyes and light sensitive particles has been attempted.…”

Section: Introductionmentioning

confidence: 99%

Plasma polymer films for 532 nm laser micromachining

Silverstein¹

1998

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Laser micromachining with a frequency doubled Nd:YAG laser (532 nm) can replace more complex microlithographic processes for rapid turnaround in the development of prototype application-specific integrated circuits. Plasma polymerization is a rapid, dry, environmentally friendly process that yields crosslinked pinhole-free films. Plasma polymerized films of ethylene and an additional gas [PP(gas/E)] were investigated for their micromachining potential. The deposition rates, molecular structures, physical properties and optical properties of the polymers were characterized. PP(Ar/E), with relatively little oxygen and no nitrogen, with superior substrate adhesion and with no debris generated on laser micromachining was chosen as the optimal laser micromachining film. The PP(Ar/E) coefficient of optical absorption at 532 nm (α532), related to unsaturated group concentration, increased with the ratio of plasma power to ethylene mass flow rate [W/Fm(E)]. α532 reached an asymptote of 2.9 μm−1 at high W/Fm(E) and could be enhanced slightly using postpolymerization ultraviolet exposure. The optimum conditions were using Ar/E=1/1 and 75 W to produce a 0.6 μm thick film for micromachining at 2 J/cm2 focused 0.25 μm beneath the surface. The laser pulse in a 1.2 μm thick film was not fully developed at 2 J/cm2 and exhibited rounded corners at 4 J/cm2, indicating that multiple low energy pulses would be preferable. A complicated and densely packed pattern with several different pulse sizes in which neighboring holes from pulses in close proximity do not merge was accurately reproduced in PP(Ar/E) using laser micromachining.

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Ceramic Chip Carriers

Knickerbocker¹,

Redmond²

2001

Area Array Interconnection Handbook

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The application of laser process technology to thin film packaging

Cited by 9 publications

References 18 publications

Cumulative Heat Effect in Excimer Laser Ablation of Polymer PC and ABS

Cumulative Heat Effect in Excimer Laser Ablation of Polymer PC and ABS

Plasma polymer films for 532 nm laser micromachining

Ceramic Chip Carriers

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