2008
DOI: 10.1016/j.jelechem.2008.05.012
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The autocatalytic reduction of copper(II) by cobalt(II) in aqueous diethylenetriamine solutions studied by EQCM

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Cited by 11 publications
(11 citation statements)
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“…These results agree with those previously seen in voltammetric curves, which suggested that the Cu (II) ion reduction in a Cu-Co bath containing glycine was favored by the increase of [Co 2+ ], most likely due to the formation of Co (II)-glycine complexes that may act as strong reducing agents, enhancing the Cu (II) ions deposition by electroless process [39,40]. It is important to mention, however, that the reduction process of Cu (II) ions (either by electrochemical or electroless paths) in the presence of Co (II)-amine complexes is strongly dependent on the pH, the kind of the amine ligand and on [Co 2+ ] [39,40].…”
Section: Copper Content In the Alloy (Wt% Cu)supporting
confidence: 91%
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“…These results agree with those previously seen in voltammetric curves, which suggested that the Cu (II) ion reduction in a Cu-Co bath containing glycine was favored by the increase of [Co 2+ ], most likely due to the formation of Co (II)-glycine complexes that may act as strong reducing agents, enhancing the Cu (II) ions deposition by electroless process [39,40]. It is important to mention, however, that the reduction process of Cu (II) ions (either by electrochemical or electroless paths) in the presence of Co (II)-amine complexes is strongly dependent on the pH, the kind of the amine ligand and on [Co 2+ ] [39,40].…”
Section: Copper Content In the Alloy (Wt% Cu)supporting
confidence: 91%
“…It means that, increased [Co 2+ ] may enhance Cu (II) deposition from these baths. Considering that many Co (II) complexes with amines are labile and act as strong reducing agents capable of reducing some metal ions (such as Cu (II)) to the metallic state through an electroless process [39,40], the presence of Co (II)-glycine complexes most likely enhanced electroless Cu (II) reduction, explaining the shift of C′2 to less negative potentials.…”
Section: Resultsmentioning
confidence: 99%
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“…Ethylenediamine as a ligand is not an exclusive amine for Co 3+ -Co 2+ redox couples in the electroless copper plating systems. Co 2+ complexes with other higher polyamines, e.g., propylene diamine (propane-1,2-diamine) [ 29 , 30 ], diethylenetriamine [ 31 , 32 ], or pentaethylenehexamine [ 33 ], and are eligible reducing agents to reduce Cu 2+ to the metallic state on a surface to be plated.…”
Section: Introductionmentioning
confidence: 99%
“…Then, the sub-layer of Co was deposited on the TiO 2 NTs surface via electroless deposition as previously reported. 31 Deposition of electroless Co layer was carried out for 45 min at room temperature. The Au crystallites were deposited on the prepared Co/TiO 2 -NTs electrodes by their immersion into 1 mM HAuCl 4 + 0.1 M HCl (denoted as Au(III)-containing solution) for 0.5, 1 and 5 min, respectively.…”
mentioning
confidence: 99%