The Challenges of Fine Pitch Copper Wire Bonding in BGA packages

Ibrahim, Mohd Rusli; Choi, Yong Cheng; Lim, Loon Aik; Lü, Jing; Poh, Low Teck; Ai, Poh Chiew

doi:10.1109/iemt.2006.4456478

Cited by 11 publications

(6 citation statements)

References 1 publication

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“…Results from recently published work have shown that Cu wire bonding requires more rigorous bonding process control and more strict packaging material selection. [1,2] To better quantify the impact of these improvements and changes on the overall reliability performance at the component level, acceleration testing with durations beyond the typical JEDEC qualification requirements would be an effective approach to collect lifetime data and relative performance compared with Au wires.…”

Section: Introductionmentioning

confidence: 99%

An evaluation of effects of molding compound properties on reliability of Cu wire components

Seki

Chen³

et al. 2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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Copper (Cu) bond wires are increasingly used in semiconductor components to replace gold (Au) bond wires, and applications for these components are expanding from consumer to high-reliability electronic systems. To assess the impact of this conversion on the overall component reliability, extended reliability testing beyond the typical JEDEC component qualification testing is needed. Additionally, key packaging materials such as molding compound also need to be re-evaluated as they may interact with Cu wire bond differently from Au wires and introduce new failure mechanisms. In this work, we investigate the impact of molding compound chemistry on the reliability performance by varying two material properties, pH level and Clconcentration. A total of 9 formulations are generated for a 16-lead SOP (Small Outline Package) package. The assembled components are subject to two acceleration tests including biased-HAST (Highly Accelerated Stress Testing) and HTS (High Temperature Storage) test. As a control, Au wires are used for some of the cells and are subject to the same acceleration tests as the Cu wire components. The failure rates for all of the experimental cells will be reported. The effects of pH and Cl-levels on the failure rates will be discussed. Additionally, analytical results on the failed components using FIB (Focus Ion Beam), SEM (Scanning Electron Microscopy), and EDX (Energy Dispersive X-ray) will be reported. The reliability testing and analytical results will demonstrate the importance of controlling molding compounds properties and provide guidelines for the selection of these materials. For high-reliability and mission-critical electronic systems, improved and better-controlled packaging material formulations will be needed to ensure the long-term reliability of components using Cu bond wires.

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Section: Introductionmentioning

confidence: 99%

An evaluation of effects of molding compound properties on reliability of Cu wire components

Seki

Chen³

et al. 2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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“…The most distinguishable feature of Cu wire bonding compared to conventional Au wire bonding, however, is the tiny coverage and slow growth of Cu-Al IMCs [1,3,[13][14][15][16][17][18][19][20][21][22]. Though slow Cu-Al IMC growth is considered an advantage in enhancing reliability of Cu wire bonding [1,3,9,10,12,16,21,23], the strong bondability right upon bonding yet with tiny IMC coverage on the Cu-Al interface has attracted intensive investigations; as a result several hypotheses on the bonding mechanism have been proposed [14][15][16]20,23].…”

Section: Literature Reviewmentioning

confidence: 99%

Fine pitch copper wire bonding — Why now?

Appelt¹,

Tseng²,

Lai

2009

2009 11th Electronics Packaging Technology Conference

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“…Most common research area lingers around processing and material issues of copper wire bonds [1&2]. There are also numerous efforts put in studying quality and reliability of bonded devices using copper wire on different types of bonding pad [2][3][4][5].…”

Section: Wire Bonding Processmentioning

confidence: 99%

Failure analysis for Copper Wire Bonding process from machine perspective

Ab-Samat¹,

Kamaruddin²,

Azid³

2008

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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In fast changing and very competitive industry like semiconductor manufacturing. reliability or probability of failure always has been a crucial part in any processes and operation involving machine and equipment. One of many electronic manufacturing tecImologies is Wire Bond process, which entails a flexible and an accurate tecImology because of fast changing market demand for smaller electronic gadgets. Nature of wire bond process which is very delicate, usually makes any failures happen during tins type of operation goes unnoticed for sometimes and tins situation will cost the company a fortune. This paper aims to discuss equipment reliability based on failure occurrences in wire bond process using copper wire.Copper bonding has received attention because of its low cost high electrical conductivity and resistance to wire sweep during plastic encapsulation. However. copper have hard properties thus more care is required during bonding as to avoid cratering problem. With the situation. tins paper was written to find and analyze macInne failure using Failure Mode and Effect Analysis (FMEA) teclulique to verify machine capability and problems faced when operating using Copper wire. Furthennore. general approach for improvement plan based on type of failure and failure causes are presented as conducted in a sennconductor company in Malaysia. The finding of the study provides evidence that failure analysis is an important task to be done in order to understand machine capability and reliability.

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The Challenges of Fine Pitch Copper Wire Bonding in BGA packages

Cited by 11 publications

References 1 publication

An evaluation of effects of molding compound properties on reliability of Cu wire components

An evaluation of effects of molding compound properties on reliability of Cu wire components

Fine pitch copper wire bonding — Why now?

Failure analysis for Copper Wire Bonding process from machine perspective

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The Challenges of Fine Pitch Copper Wire Bonding in BGA packages

Cited by 11 publications

References 1 publication

An evaluation of effects of molding compound properties on reliability of Cu wire components

An evaluation of effects of molding compound properties on reliability of Cu wire components

Fine pitch copper wire bonding &#x2014; Why now?

Failure analysis for Copper Wire Bonding process from machine perspective

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Fine pitch copper wire bonding — Why now?