Boron nitride films have been deposited by a metal organic chemical vapor deposition (MO-CVD). The reaction between ammonia and triethylboron (B(C~H.0:~) is carried out in the temperature range of 750~176 with the molar ratio of NHJB(C2H.0:~ = 0-200. Colorless and transparent films are obtained at temperatures of 950~176with the molar ratio of 20-70. The composition of the films, N/B, is found to vary from 0.46 to 1.0. For a fixed NHJB(C.,H~):~, the deposition rate increases with temperature up to 1000~ and then decreases. The deposition rate shows an Arrhenius-type behavior in the temperature range of 750~176 X-ray diffraction studies indicate that the crystal structure of the films is hexagonal. The energy of the direct allowed transition, obtained from optical measurements, is estimated to be 5.90 eV.Several papers have been published describing the preparation of boron nitride films, the physical-and chemical properties, and the potential applications of those films. Boron nitride films have been prepared by chemical vapor deposition (CVD) using borontrichloride or diborane as source materials (1-3). Recently in the preparation of compound semiconductors, CVD using metalorganic compounds has been developed, and its achievements have become of major interest lately. This method, called MOCVD, has been developed with reference to the deposition of GaAs by Manasevit (4) in 1968, and a number of related papers have been reported mainly for the growth of III-V compound semiconductors (5-7).In a previous paper (8), we reported on the amorphous boron nitride films deposited by the molecular flow chemical vapor deposition (MFCVD), by which we could control the composition easily. In this paper, we report the preparation and properties of boron nitride films deposited using triethylboron and ammonia by MOCVD.
ExperimentsTriethylboron (TEB, Arfa Products, 98%); ammonia (99.9%), hydrogen (99.999%), and argon (99.995%) were used to grow boron nitride films by CVD. Sapphire (12 • 12 • 0.6 mm 3) and silicon (12 x 12 • 0.25 mm 3) were used as substrates.The schematic diagram of the apparatus for the deposition of boron nitride is shown in Fig. 1. The fused quartz reaction tube has an inside diameter of 25 mm and is 600 mm long. Substrates were put on the substrate holder (sintered boron nitride) with slope of 20 ~ against the horizon and heated by external heating furnace. The substrate temperature was determined by a thermocouple attached at the rear of substrate holder.Trfethylboron was transported by bubbling hydrogen through the TEB. The temperature of the TEB saturator was controlled between 0 ~ and 25~ TEB is a colorless clear liquid, and is moisture and air sensitive and pyrohoric. The vapor pressure at 0~ is 12.5 torr (9). The flow of TEB was determined from the loss of TEB in the saturator. The preparation conditions of boron nitride films are summarized in Table I.The crystal structures of the deposited films were studied by x-ray diffraction. Optical transmission and reflection spectra of films deposited on sapph...