The compact thermal model of the pulse transformer

Górecki, Krzysztof; Rogalska, Małgorzata

doi:10.1109/therminic.2013.6675237

Cited by 7 publications

(6 citation statements)

References 9 publications

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“…The voltage source T a models ambient temperature. As it results from investigations, the results of which are given in Górecki and Rogalska, thermal time constants describing self and mutual transient thermal impedances in the transformer do not differ significantly, while the considered transient thermal impedances differ only in values of thermal resistance. Therefore, in the described model, common RC networks were used to model self‐heating and mutual thermal couplings.…”

Section: Model Formmentioning

confidence: 94%

“…Therefore, in the described model, common RC networks were used to model self‐heating and mutual thermal couplings. Using the results of measurements shown in previous works, it was assumed that P thur1 = 0.8 P thu and P thru1 = 0.8 P thr .…”

Section: Model Formmentioning

confidence: 99%

“…In papers, linear transformer models taking into account coupling between windings and winding resistances were presented. In turn, in Borkowski, a linear model of a transformer, whose network representation is shown in Figure , was described.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Modelling characteristics of the impulse transformer in a wide frequency range

Górecki

Godlewska

2020

Circuit Theory & Apps

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In the paper, a new compact electrothermal model of the impulse transformer is proposed. This model has a form of a subcircuit dedicated for SPICE and could be used for low power impulse transformers applicable in switch-mode power supplies used in electronics. It takes into account simultaneously electric, thermal, and magnetic phenomena occurring in the considered device and describe nonidealities of the core and windings. The form of the elaborated model and analytical dependences describing all its components are presented. Correctness of this model is verified experimentally in a wide range of frequency and load resistance for selected constructions of transformers. Satisfactory agreement between the results of computations and measurements is obtained K E Y W O R D S compact electrothermal models, impulse transformer, modelling, SPICE

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Section: Model Formmentioning

confidence: 94%

Section: Model Formmentioning

confidence: 99%

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Modelling characteristics of the impulse transformer in a wide frequency range

Górecki

Godlewska

2020

Circuit Theory & Apps

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“…A equivalent model is developed on the basis of the thermal network method (TNM) [26][27][28][29][30][31][32] for the validation of experimental results. In the equivalent model, thermal resistance and capacitance derived from material properties and size form a box-shaped mesh, as shown in Fig.…”

Section: Equivalent Model For Transient Thermal Analysismentioning

confidence: 99%

Investigation of transient thermal dissipation in thinned LSI for advanced packaging

Araga¹,

Shimamoto²,

Melamed³

et al. 2018

Jpn. J. Appl. Phys.

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Thinning of LSI is necessary for superior form factor and performance in dense cutting-edge packaging technologies. At the same time, degradation of thermal characteristics caused by the steep thermal gradient on LSIs with thinned base silicon is a concern. To manage a thermal environment in advanced packages, thermal characteristics of the thinned LSIs must be clarified. In this study, static and dynamic thermal dissipations were analyzed before and after thinning silicon to determine variations of thermal characteristics in thinned LSI. Measurement results revealed that silicon thinning affects dynamic thermal characteristics as well as static one. The transient variations of thermal characteristics of thinned LSI are precisely verified by analysis using an equivalent model based on the thermal network method. The results of analysis suggest that transient thermal characteristics can be easily estimated by employing the equivalent model.

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“…e , with the use of the conception of local estimation, is described in [23]. In turn, in the paper [36], the method of measuring transient thermal impedance of the core is formulated, whereas in the papers [23,36], the method of estimating the values of thermal capacitances C thi and thermal resistances R thi on the basis of the measured waveform of transient thermal impedance is described. The value of R th is estimated by averaging the waveform Z th (t) in the steady state, whereas the values of the parameters C thi and R thi are determined by the least square method.…”

Section: Estimation Of the Model Parametersmentioning

confidence: 99%

Electrothermal Model of Ferromagnetic Cores

Górecki¹

2015

ELECTROTECHNICAL REVIEW

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This paper presents an electrothermal model of ferromagnetic cores dedicated for SPICE software. The form of this model, dedicated to be used in power electronics applications, is presented and the procedure of estimating magnetic, geometric and thermal parameters of the presented model is proposed. The correctness of the proposed model is verified by comparing the calculated and measured characteristics of the selected ferromagnetic cores operating at different values of flux density, frequency, ambient temperature and cooling conditions. The satisfied agreement between the results of calculations and measurements is obtained.

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The compact thermal model of the pulse transformer

Cited by 7 publications

References 9 publications

Modelling characteristics of the impulse transformer in a wide frequency range

Modelling characteristics of the impulse transformer in a wide frequency range

Investigation of transient thermal dissipation in thinned LSI for advanced packaging

Electrothermal Model of Ferromagnetic Cores

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