2003
DOI: 10.1017/s1431927603030034
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The Correlation between Ion Beam/Material Interactions and Practical FIB Specimen Preparation

Abstract: Abstract:The focused ion beam~FIB! tool has been successfully used as both a stand alone analytical instrument and a means to prepare specimens for subsequent analysis by SEM, TEM, SIMS, XPS, and AUGER.In this work, special emphasis is given to TEM specimen preparation by the FIB lift-out technique. The fundamental ion/solid interactions that govern the FIB milling process are examined and discussed with respect to the preparation of electron transparent membranes. TRIM, a Monte Carlo simulation code, is used … Show more

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Cited by 100 publications
(76 citation statements)
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“…For example, Prenitzer et al showed visible changes (using SEM) in the shape of the excavated spots and higher amounts of redeposited material at primary intensities of 500, 1000, and 2000 pico-amperes in Ga + ion milling experiments on silicon. 53 From these observations and from the significance of the primary-ion beam obtained in the models, the possibility that the pico-ampere oscillations of the primary ion current at usual operating conditions of the Cameca 1280HR could induce a detectable IMF seems plausible. This effect could be even more evident in the SIMS analyses carried out using picoampere primary currents, e.g.…”
Section: Chamber Pressurementioning
confidence: 92%
“…For example, Prenitzer et al showed visible changes (using SEM) in the shape of the excavated spots and higher amounts of redeposited material at primary intensities of 500, 1000, and 2000 pico-amperes in Ga + ion milling experiments on silicon. 53 From these observations and from the significance of the primary-ion beam obtained in the models, the possibility that the pico-ampere oscillations of the primary ion current at usual operating conditions of the Cameca 1280HR could induce a detectable IMF seems plausible. This effect could be even more evident in the SIMS analyses carried out using picoampere primary currents, e.g.…”
Section: Chamber Pressurementioning
confidence: 92%
“…The reason for this decrease in material removal rate at high aspect ratios can be attributed to material redeposition. [33][34][35] It becomes more and more difficult to remove material from a deep yet narrow (i.e., high aspect ratio) structure because the material has to be expelled a long way to escape the top surface of the substrate, and there is a high probability that the material will be redeposited along the sidewalls within the structure itself. Alternatively, we can also explain the reduced material removal rate observed for high aspect ratio structures kinematically.…”
Section: Dependence Of Materials Removal Rate On Aspect Ratio Of MImentioning
confidence: 99%
“…As can be seen from the figure, the channel walls are V-shaped, which suggests that it is quite difficult to remove material from the bottom of this high aspect ratio channel due to material redeposition. [33][34][35] Consequently, in this case, milling any deeper than about 3 lm in depth does not result in any further increase in the depth of the structure actually milled.…”
Section: Dependence Of Materials Removal Rate On Aspect Ratio Of MImentioning
confidence: 99%
“…There are also issues with the milling process itself with regard to differential milling rates in different materials and the re-deposition of milled material [9].…”
Section: Fib Milling and Sem Imagingmentioning
confidence: 99%