Objective.
To investigate the effect of poly-acrylic acid (PAA) copper iodide (CuI) adhesives onbond degradation, tensile strength, and biocompatibility.
Methods.
PAA-CuI particles were incorporated into Optibond XTR, Optibond Solo and XP Bondin 0.1 and 0.5 mg/ml. Clearfil SE Protect, an MDPB-containing adhesive, was used as control.The adhesives were applied to human dentin, polymerized and restored with compositein 2 mm-increments. Resin–tensilebond strength after 24 h, 6 months and 1 year. Hourglass specimens (10 × 2 × 1 mm) wereevaluated for ultimate tensile strength (UTS). Cell metabolic function of human gingivalfibroblast cells exposed to adhesive discs (8 × 1 mm) was assessed with MTT assay. Copperrelease from adhesive discs (5 × 1 mm) was evaluated with UV–vis spectrophotometer afterimmersion in 0.9% NaCl for 1, 3, 5, 7, 10, 14, 21 and 30 days. SEM, EDX and XRF were conductedfor microstructure characterization.
Results.
XTR and Solo did not show degradation when modified with PAA-CuI regardless ofthe concentration. The UTS for adhesives containing PAA-CuI remained unaltered relative tothe controls. The percent viable cells were reduced for Solo 0.5 mg/ml and XP 0.1 or 0.5 mg/mlPAA-CuI. XP demonstrated the highest ion release. For all groups, the highest release wasobserved at days 1 and 14.
Significance.
PAA-CuI particles prevented the bond degradation of XTR and Solo after 1 yearwithout an effect on the UTS for any adhesive. Cell viability was affected for some adhesives.A similar pattern of copper release was demonstrated for all adhesives.