1989
DOI: 10.1109/16.22479
|View full text |Cite
|
Sign up to set email alerts
|

The design of thin-film polysilicon resistors for analog IC applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
10
0

Year Published

2005
2005
2015
2015

Publication Types

Select...
5
2
2

Relationship

0
9

Authors

Journals

citations
Cited by 64 publications
(10 citation statements)
references
References 11 publications
0
10
0
Order By: Relevance
“…This property of the polysilicon MOS gate is utilized in the tunable color photogate design. It is worth noting that the gate is a well-fabricated structure in the CMOS process, with an intra-die thickness variation on the order of 3% [30]. The resulting variation of the optical transmittance can be observed in Fig.…”
Section: A Qualitative Analysismentioning
confidence: 95%
“…This property of the polysilicon MOS gate is utilized in the tunable color photogate design. It is worth noting that the gate is a well-fabricated structure in the CMOS process, with an intra-die thickness variation on the order of 3% [30]. The resulting variation of the optical transmittance can be observed in Fig.…”
Section: A Qualitative Analysismentioning
confidence: 95%
“…Resistors can be constructed using doping implants in the mono-crystalline silicon substrate [64] (so-called n+ and p+ resistors) but also by depositing doped polysilicon [146] (n-poly and p-poly resistors). Within these construction methods, often different subcategories such as high-resistive or low-resistive polysilicon are available.…”
Section: Resistors In Standard Cmosmentioning
confidence: 99%
“…These junctions cause a small nonlinearity in the I-V transfer characteristic. In most cases, however, this is negligible [146]. Furthermore, the temperature dependency of the bulk resistance of n-poly and p-poly is opposite, which can be used to obtain a temperature-independent resistor [31].…”
Section: Resistors In Standard Cmosmentioning
confidence: 99%
“…In a contemporary submicron process, the temperature coefficients of polysilicon and all diffused resistors are usually positive, probably because mobility decreases with temperature, although dedicated highresistance polysilicon can have a negative temperature coefficient [31,32]. For off-chip components, the temperature coefficients of surface-mount thin-film chip resistors are typically less than ±200 ppm/ • C [33].…”
Section: Influence Of Temperature Dependence On Choice Of Resistancementioning
confidence: 99%